SMT, PCB Electronics Industry News

Step-Up Stencils with the StencilLaser

Nov 21, 2013

LPKF Presents Spot Welding Process for Stencils.

A step stencil is an SMD stencil made with local depressions (step-down) or raised areas (step-up) to allow the solder paste volume to be varied locally. This allows for mounting of both SMD components with a low pitch and robust connection components on PCBs in a single step.

Polished section of a step stencil: The step-up region (yellow) lies within a step-down zone – a design that is useful, for example, for QFPs with heat sinks.

In a newly presented study, LPKF investigates the suitability of the StencilLaser G 6080 and defines the parameters for a reliable process window. The foil reinforcements are applied by spot welding to yield local total material thicknesses of up to 200 µm. The results of the study are available for free on the LPKF website at www.lpkf.com.


LPKF Laser & Electronics AG manufactures machines and laser systems used in electronics fabrication, medical technology, the automotive sector, and the production of solar cells. Around 20 percent of the workforce is engaged in research and development.

Jan 29, 2014 -

LPKF Expands Management Team

Jan 16, 2014 -

Rapid Prototyping of Printed Circuit Boards at AFCEA West

Nov 21, 2013 -

New LPKF ProtoMat D104 with UV Laser Tool

Nov 15, 2013 -

LPKF raises guidance slightly for 2013

Sep 10, 2013 -

Wave of innovation at productronica fair - LPKF presents four new systems in Hall B2, Booth 105

Aug 27, 2013 -

In-House PCB Prototyping Comes to Eptech Mississauga and Ottawa

Jan 18, 2013 -

PCB Processing Solutions a Highlight of IPC/APEX Expo 2013

Dec 03, 2012 -

New Webinar Explores SMT Stencil Aperture Size and its Relationship with Solder Paste Volume

Sep 12, 2012 -

LPKF to Showcase UV Depaneling System at SMTA International

Aug 23, 2012 -

LPKF to Showcase Top-of-the-Line PCB Milling Machine at PCB West 2012

22 more news from LPKF Laser & Electronics »

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Nordson ASYMTEK Receives 2017 Global Technology Award for the NexJet NJ-8 Jetting System with ReadiSet 2-piece Jet Cartridge Award presented at Productronica 2017

Dec 07, 2017 -

Banner Engineering Completes Implementation of Optel Software on ASM Lines in Minneapolis and Suzhou (China)

Dec 06, 2017 -

Pan Pacific Microelectronics Symposium Program Finalized

Dec 05, 2017 -

Scienscope Promotes Don Jeka to National Sales & Marketing Manager for Its X-ray Division

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 05, 2017 -

Indium Corporation’s Vareha-Walsh to Present at International Electronic Recycling Congress (IERC) 2018

Dec 04, 2017 -

SCS to Discuss How Ultra-Thin Conformal Coatings Increase the Reliability of Critical Electronics during PennWell Webinar

Dec 04, 2017 -

Anda Automation Expands into Hungary

Dec 04, 2017 -

Ersa Congratulates IPC Hand Soldering Competition Champions

Dec 04, 2017 -

IPC Optimistic After U.S. Senate Passes Tax Reform Bill

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