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Indium Corporation’s Technology Experts to Present at IPC Conference on Assembly and Reliability

Nov 14, 2013

Sze Pei Lim, Indium's Technical Manager - Asia-Pacific Operations.

Sze Pei Lim, Indium's Technical Manager - Asia-Pacific Operations.

Sehar Samiappan, Indium's Area Technical Manager.

Sehar Samiappan, Indium's Area Technical Manager.

Indium Corporation's Sze Pei Lim, Technical Manager - Asia-Pacific Operations, and Sehar Samiappan, Area Technical Manager, will present at the IPC Conference on Assembly and Reliability November 20 in Bangkok, Thailand.

Sze Pei’s presentation, "Optimizing Void Performance of QFN Assembly", explores several tested and proven strategies to minimize voiding in QFN assemblies, including thermal pad design and patterning, via placement, and the addition of a flux-coated solder preform.

Sehar’s presentation, "Alternate Lead-Free Soldering Alloy", discusses a variety of alternative Pb-free soldering alloys, including the mainstream SAC305, and compares them against the benchmark eutectic SnPb solders.

Sze Pei is responsible for managing Indium Corporation’s technical teams throughout the Asia-Pacific region. She joined Indium Corporation in 2007 as an Area Technical Manager. She earned her bachelor’s degree in Chemistry from the National University of Singapore, and has 17 years of experience in the SMT and PCB assembly industries.

Sehar provides field technical support to Indium Corporation’s customers. He conducts process evaluations, product trainings, designs of experiments (DOEs), and helps diagnose productivity issues in customer factories. Sehar is an electrical engineer with over 18 years of experience, mainly in the area of process, failure analysis, and production. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt

The IPC Conference on Assembly and Reliability focuses on practical methodologies that can be developed today, providing critical information for staff and managers responsible for reliability. Industry experts representing every market sector will discuss solder technology, testing strategies, and materials compliance. Focused presentations will address strategic reliability considerations related to solder alloys and the latest packaging technologies - targeting issues such as void formation and electrochemical migration – and offer risk mitigation processes and data analysis.


Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.

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