MIRTEC, “The Global Leader in Inspection Technology,” announces that it was awarded a 2013 Global Technology Award in the category of Inspection – AOI for its MV-9 2D/3D CoaXPress In-Line AOI Series. The award was presented to the company during a Tuesday, November 12, 2013 ceremony that took place at the New Munich Trade Fair Centre in Munich, Germany during Productronica. This marks the company’s 20th industry award.
“The 2013 Global Technology Award represents the 20th industry award that has been presented to MIRTEC in recognition of our Technologically Advanced Inspection Solutions,” stated Brian D’Amico, President of MIRTEC Corp. “It is truly our pleasure to accept this award on behalf of MIRTEC’s extremely talented engineering team for their outstanding performance in the design and development of the MV-9 2D/3D CoaXPress AOI machine. We are confident that this Advanced Technology will not only provide unprecedented speed and performance to the electronics inspection industry, but will undoubtedly set a new standard by which all other inspection equipment will be measured.”
MIRTEC’s all new MV-9 2D/3D CoaXPress In-Line AOI systems are configured with MIRTEC’s exclusive OMNI-VISION® 2D/3D Inspection Technology that combines 25 Mega Pixel 2D Inspection with advanced Digital Multi-Frequency Quad Moiré 3D inspection to provide precision inspection of SMT devices on finished PCB assemblies. The MV-9 systems may be configured with a state-of-the-art CoaXPress 25 Mega Pixel top-down camera system. This proprietary camera system is designed and manufactured by MIRTEC for use with the company’s complete product range of inspection equipment.
MIRTEC’s revolutionary CoaXPress Camera Technology is capable of providing data transfer rates of 25 Gbit/Second making the MV-9 the fastest 2D/3D AOI system in the world! MIRTEC’s revolutionary Digital Multi- Frequency Quad Moiré Technology provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four (4) Moiré Inspection Probes. This proprietary system yields precise height measurement data necessary to detect lifted component and lifted lead defects as well as solder volume post reflow. MIRTEC’s technologically advanced Six Phase Lighting System uses multi-color LEDs to illuminate inspection areas from six different angles providing superior solder joint characterization and co-planarity inspection of leads on gull-wing devices. The SIDE-VIEWER® Camera System provides four 10 Megapixel angled cameras for automatic inspection of areas that are inaccessible with a Top-Down camera i.e. solder joint inspection for J-Leaded devices. The system also provides defect review from four camera angles for efficient defect analysis and classification. The MV-9 is configured with a Precision Linear Drive Positioning System providing high-speed, high-precision robot movement with rapid response, zero backlash and best of all zero maintenance.
Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.
MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry.
For further information, please visit www.mirtec.com.