SMT, PCB Electronics Industry News

Pick-and-Place Machine with Integrated Solder Paste Jet Printer

Nov 09, 2013

Essemtec AG presents its new SMT production centre for the first time at productronica in Munich. Jetting of solder paste instead of printing saves costs for stencils and enhances the production flexibility especially for lower to midsize volumes. Until today, separate machines have to be bought to fulfil this requirement.  Essemtec is merging its dispensing and pick-and-place know how of the Scorpion and Paraquda machines into an SMT production centre that will be on display at Essemtec’s booth in hall A3, booth 341.

High productivity
Jet printing is faster (up to 80’000 dots/h) and more precise than any other dispensing system for solder pastes. So far, jetting of pastes has only been possible with specially designed, costly solder pastes. The new system from Essemtec opens the range of pastes to most type 4, 5, 6 or 7 pastes.

The combination of jet printing with pick-and-place eliminates the need to program two different machines and reduces the investment costs dramatically. Set up is done directly from CAD data using an integrated paste library. Production is fully automated and the application of solder paste and the placement of components are seamlessly integrated while process monitoring ensures high quality results.

Quick return on investment
The return on investment of the Jet Printing option is achieved approximately within 150 - 200 stencils and even fasters if the products require stepped stencils. For higher throughput, the Jet Printing option can also be installed on the multiple module Production Centre Paradoble which will also premier at productronica at Essemtec’s booth in hall A3, booth 341.


The Swiss equipment manufacturer Essemtec is the market leader for flexible production systems for electronic assembly and packaging. Essemtec has been developing, manufacturing and marketing equipment for all processes in the electronics industry since 1991: such as printers, jet dispensers, pick-and-place and soldering systems. Manual, semiautomatic and fully automatic systems are available. The range of products also includes transportation and storage systems, as well as software solutions for planning, simulation optimization and documentation of manufacturing. All Essemtec systems are optimized for maximum flexibility. Users can switch from one product to another quickly, making maximum use of available production capacity.

Essemtec - Be more flexible.

Jan 24, 2018 -

Essemtec to Show All-in-One High Speed Assembly / Dispensing Platform at APEX

Oct 16, 2017 -

Puma/Tarantula - Essemtec‘s P&P/dispenser innovation at productronica

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Jul 27, 2017 -

Essemtec to show all-in-one jetting/placement system at SMTA Capital Expo: the perfect NPI machine

Feb 21, 2017 -

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Jan 11, 2017 -

Essemtec Announces Placement & Jetting in a Single Pass Through with the New FOX2

Nov 21, 2016 -

Juerg Schuepbach Joins Essemtec as International Sales Manager

Oct 13, 2016 -

Essemtec's FOX Offers Hassle-Free Manufacturing of 2.5D Assemblies - Learn More at the Upcoming SMTA Expos

Sep 12, 2016 -

Essemtec Will Demonstrate the Spider Jet Dispenser at IMAPS 2016 in Pasadena

Sep 06, 2016 -

New Compact Pick-and-Place with Linear Motors to be Displayed at SMTA Guadalajara

188 more news from ESSEMTEC »

Feb 19, 2018 -

Horizon Sales Heads to San Diego for APEX!

Feb 19, 2018 -

Cogiscan Is Growing: New Regional Sales Manager for the Americas

Feb 19, 2018 -

CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology Recognized as Best Known Method (BKM) at SEMICON China

Feb 19, 2018 -

Award-Winning Reflow, Selective Solder & Rework from Ersa at SMTA Intermountain Expo

Feb 19, 2018 -

SMTA Capital Chapter to Host Chapter Tutorial Program

Feb 19, 2018 -

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Feb 19, 2018 -

Nordson YESTECH Installs BX Benchtop AOI System at Fluid Components International

Feb 19, 2018 -

BTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China

Feb 19, 2018 -

CyberOptics Demonstrates Yield-Improving Wireless Measurement Devices for Semiconductor Tools at SPIE

Feb 19, 2018 -

Presaturated Surface Prep Wipe

See electronics manufacturing industry news »

Pick-and-Place Machine with Integrated Solder Paste Jet Printer news release has been viewed 797 times

SMT in-printer dispensing

SMT Machines