SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


  • SMTnet
  • »
  • SMT, PCB Electronics Industry News
  • »
  • Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium

Nov 01, 2013

Tin whisker growth is difficult to prevent but researchers at Brown University believe they have identified the root cause of tin whiskers which are blamed for product defects in every electronics market sector. Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.

We’re convinced it’s got to be stress from the intermetallics that causes tin whiskers to form,” says Chason. His presentation, “Real Time Study of Whiskers/Hillock Formation in Sn-Cu Systems During Thermal Cycling,” will provide information on the systematic experiments conducted to confirm it.

The symposium will begin with a keynote presentation on space industry requirements, “Space: The Intolerant Final Frontier,” by John Kowalchik, vice president of Mission Success, Lockheed Martin. Other featured presentations include: “Tin Whisker Risk Mitigation at a Large Defense OEM — Past Present and Future,” by  David Pinsky, Ph.D., Raytheon; “Conformal Coating Materials & Applications: State of the Industry Assessment,” by Dave Hillman, Rockwell Collins; and “Corrosion Induced Tin Whiskers – Influence of Tin Plating,” by Pierre Eckold, M.Sc., Robert BOSCH GmbH.

The 7th International Tin Whiskers Symposium precedes the IPC Conference on Solder and Reliability, which runs from noon November 13 through November 14. These back-to-back events will provide an ideal setting for a comprehensive update on reliability issues, with access to people who are experts in their fields. 

Complete agenda and registration information for the 7th International Tin Whiskers Symposium can be found at www.ipc.org/tin-whiskers.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

Dec 06, 2016 -

IPC Study on North American PCB Industry Reports Growth in Military/Aerospace Market

Nov 30, 2016 -

North American PCB Book-to-Bill Ratio Climbs to 1.08

Nov 17, 2016 -

PCB Executive Forum Focuses on Critical Issues Senior-level executives to meet at IPC APEX EXPO

Nov 15, 2016 -

Turn Inspiration into Innovation through IPC APEX EXPO 2017 Educational Programs

Nov 09, 2016 -

IPC Releases New Online Training Course, IPC Essentials

Nov 09, 2016 -

IPC Issues Statement on the 2016 Election Results

Nov 07, 2016 -

ISC Engineering, LLC Earns Certification as Qualified Manufacturer to IPC/WHMA-A-620

Oct 20, 2016 -

Session 4 of IPC & SMTA's Conference to Focus on Ultra-Thin or Nanocoatings

Oct 20, 2016 -

World PCB Production in 2015 Estimated at $58.6 Billion IPC World PCB Production Report Released

Oct 20, 2016 -

Mayim Bialik Chosen as Opening Keynote at IPC APEX EXPO 2017 Industry votes to hear from actress and neuroscientist

(789) more news from Association Connecting Electronics Industries (IPC)

Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium news release has been viewed 798 times

  • SMTnet
  • »
  • SMT, PCB Electronics Industry News
  • »
  • Is Stress the Root of Tin Whisker Growth? Brown University professor and other experts to present research at 7th International Tin Whiskers Symposium
Plasma Prior to Conformal Coating

SMT Equipment