SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

Oct 31, 2013

Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.

Hesse Mechatronics will demonstrate:

Large diameter copper (Cu) heavy wire capability on the Bondjet BJ935 Fully Automatic Heavy Wire Bonder

Heavy wire bonder full automation capabilities on the Bondjet BJ935, featuring the only heavy wire bondhead with non-destructive pull test and a unique transducer integrated sensor for 100% quality monitoring in real-time

Lead frame indexing on the Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder, meeting the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specialized bond heads that can be changed out in minutes

The industry standard for thin wire wedge bonding speed and accuracy with the Bondjet BJ820 High Speed Fully Automatic Fine Wire Wedge Bonder, offering speed of up to 7 wires/sec., accuracy of 1 μm at 3 σ axis repeatability, in addition to the largest work area

For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website at www.hesse-mechatronics.com.  For more information on Hesse Mechatronics’ training and applications support services in the Americas and to see wire bonding in action, please visit www.wirebonddemo.com or e-mail info@hesse-mechatronics.us.


World leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, Hesse GmbH is a privately held company that designs and manufactures thin wire wedge bonders for aluminum and gold, and heavy wire wedge bonders for aluminum, gold and copper, round wire and ribbon, including HCR™ (High Current Ribbon).
About Hesse Mechatronics, Inc.

Hesse Mechatronics is the Americas subsidiary of Hesse GmbH, providing sales and support for Hesse Mechatronics wedge wire bonding equipment in the United States, Canada, Mexico and Central and South America. The company also provides wire bonding equipment training, applications support, development and production of prototypes and pre-production manufacturing in four applications and demonstration labs throughout the USA.

Jan 24, 2014 -

Hesse Mechatronics Appoints Representative for South America

Jun 07, 2013 -

New Dual-Head Wedge Bonder Makes Americas Debut

May 06, 2013 -

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Apr 13, 2013 -

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Mar 06, 2013 -

Hesse & Knipps is now Hesse Mechatronics

Mar 06, 2013 -

Hesse & Knipps is now Hesse Mechatronics.

Sep 04, 2012 -

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Aug 14, 2012 -

Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada

Aug 02, 2012 -

Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada

Jul 25, 2012 -

Hesse & Knipps, Inc. Appoints New Technical Training Manager

3 more news from Hesse Mechatronics »

Jun 26, 2017 -

Altus get SMART with Koh Young’s Innovative New Software

Jun 26, 2017 -

Ersa to Hold Versaflow 3 Level II Maintenance Training Course

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Jun 25, 2017 -

Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

See electronics manufacturing industry news »

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica news release has been viewed 3211 times

  • SMTnet
  • »
  • Industry News
  • »
  • Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica
PCB Cleaning

PCB contract manufacturer