SMT, PCB Electronics Industry News

IPC Conference to “Clean Up” Reliability Problems

Oct 28, 2013

Although no-clean practices have altered printed board manufacturing processes, reliability expert Cheryl Tulkoff warns that, “Everyone should be thinking about cleaning and contamination issues.” Tulkoff, DfR Solutions, is among the experts who will address the wide range of factors impacting reliability at the IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.

In the drive toward array packaging and other bottom termination configurations Tulkoff says, Manufacturing processes can be optimized to minimize problems and testing can help detect boards with defects, but the best way to avoid problems is to think about potential reliability issues in the design phase. She adds, “In the design phase, you can create alleys or pathways in the solder mask, and in stencil designs to allow the materials to get away from the chips. Another essential step – before manufacturing even begins – is to start with clean bare boards.”

In addition to presentations on cleaning and contamination issues, the conference agenda will cover a variety of topics, including: strategic reliability considerations, properties of solder alloys, defects like pad cratering, risk mitigation processes and data analysis. Speakers will also provide updates on: adhesives and packaging, key challenges in assembly and attachment, changes in component manufacturing as companies move from gold to copper wire bonding for cost savings and the proliferation of lead-free alloys.

IPC Conference on Solder and Reliability follows the 7th International Symposium on Tin Whiskers, which runs Tuesday, November 12 through noon on Wednesday, November 13. These back-to-back events provide an ideal setting for a comprehensive update on reliability issues, with access to people who are experts in their fields. 

Complete agenda and registration information for the IPC Solder and Reliability Conference can be found at www.ipc.org/solder-reliability.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Washington, D.C..; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Aug 10, 2017 -

Congressman John R. Carter Discusses Pro-Manufacturing Policies with IPC-member Company, VirTex

Aug 06, 2017 -

IPC Committee Selects Communication Transport Protocol for Connected Factory Initiative

Aug 01, 2017 -

North American PCB Order Growth Fuels Rise in Book-to-Bill Ratio

Jul 23, 2017 -

Senator Ron Johnson Discusses U.S. Policy Priorities in Townhall Discussion with IPC-member Company, VirTex MTI

Jul 17, 2017 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2018 Deadline for technical conference paper abstracts extended to: July 21, 2017

Jul 16, 2017 -

IPC Invites Industry Members to Participate on IPC European Standards Steering Committee

Jul 05, 2017 -

North American PCB Business Weakens but Book-to-Bill Ratio Remains Positive

Jun 29, 2017 -

IPC Invites Industry Leaders to Participate in New Global Data Service Pulse of the Electronics Industry to provide insight on health of industry

Jun 20, 2017 -

Zentech Manufacturing, Inc. First to Recertify for IPC Qualified Manufacturers Listing

Jun 14, 2017 -

IPC Submits Comments to Trump Administration Regarding Modernization of NAFTA

840 more news from Association Connecting Electronics Industries (IPC) »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

IPC Conference to “Clean Up” Reliability Problems news release has been viewed 707 times

Fully automatic selective soldering stations

Next generation soldering station - Metcal