SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications

Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications

Oct 22, 2013

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its CA-165 Low-Cost Conductive Adhesive designed for chip-on-board or general die attach applications in circuit assembly, photonics or camera modules.

ECM CA-165 is approximately half the cost of a pure silver-filled die attach adhesive, has a moderate glass transition temperature (Tg) and modulus. CA-165 has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement, and is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces.

CA-165 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the CA-165 Low Cost Electrically Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future.

For more information, visit www.emsadhesives.com.

May 01, 2017 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at Intersolar Europe

Apr 22, 2017 -

New Dry-Film Negative Photoresist for MEMS and Wafer-Level Packaging

Mar 22, 2017 -

Engineered Material Systems Introduces New UV Cured Adhesive for Bonding Lens Holders in Camera Modules

Mar 20, 2017 -

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Mar 14, 2017 -

Engineered Material Systems to Showcase CA-150 Series Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Jan 09, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Nov 14, 2016 -

New Low-Cost Snap Cure Conductive Adhesive for Stringing or Shingling Solar Modules

Oct 04, 2016 -

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

Sep 13, 2016 -

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small to Medium Size Chip Bonding

Sep 08, 2016 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

45 more news from Engineered Materials Systems, Inc. »

Jul 27, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Keynote Presenters Announced

Jul 27, 2017 -

CAMI Research Releases CableEye® USB Type-C Test Fixture, CB26U

Jul 27, 2017 -

Essemtec to show all-in-one jetting/placement system at SMTA Capital Expo: the perfect NPI machine

Jul 26, 2017 -

KIC Appoints Accomplished Engineering Manager

Jul 26, 2017 -

Count On Tools Inc. Reduces Pricing on the QWIKTRAY Custom Matrix Tray System

Jul 26, 2017 -

StratEdge Introduces New, Mobile-Friendly Website www.stratedge.com serves as resource for high-frequency semiconductor packages

Jul 25, 2017 -

Matt Tringhese Named Director of Program Manufacturing for Libra Industries

Jul 25, 2017 -

Europlacer Expands its Manufacturing Facility in France.

Jul 25, 2017 -

Europlacer Appoints Giantec in Taiwan

Jul 25, 2017 -

Making Ovens Smarter – Visit KIC at NEPCON South China

See electronics manufacturing industry news »

Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications news release has been viewed 750 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Introduces Low-Cost Conductive Adhesive for Die Attach Applications
PCB equipment

Rework Training Materials