SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • BTU International announcing that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium

BTU International announcing that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium

Oct 15, 2013

BTU International, Inc. today announced that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium, established by Universal Instruments’ Advanced Process Laboratory. In addition, BTU installed a PYRAMAX™ 100N Reflow Oven with 400°C capability in the state of the art Advanced Process Laboratory (APL).

The A.R.E.A Consortium consists of more than 30 members representing leading companies in the electronics assembly industry. The Consortium aims to develop a fundamental, mechanistic understanding of the materials and processes utilized in electronics assembly, with special focus on maximizing assembly yields and long-term reliability. A team of experienced scientists conducts fast-paced research and reports back results at quarterly meetings. All research is conducted in the APL and takes advantage of the lab’s comprehensive production and analytical equipment set.

BTU’s ovens and furnaces have long been recognized as performance leaders providing our customers with the utmost in process control.  This oven will be used to develop leading-edge processes for semiconductor packaging, high temperature related studies and electronics assembly,” said Rob DiMatteo, BTU’s eastern regional sales manager. 

Furthermore our involvement in this consortium extends our ability to partner with customers for process development, it’s a win-win,” added DiMatteo. 

BTU’s PYRAMAX™ family of high-throughput thermal processing systems is widely recognized as the global standard of excellence for both printed circuit board solder reflow and for semiconductor packaging. PYRAMAX™ systems provide optimized lead-free processing for the ultimate in productivity and efficiency. BTU’s exclusive closed loop convection control provides precise heating and cooling, programmable heat transfer, and reduced nitrogen consumption, adding up to the lowest Cost of Ownership in the industry. 


BTU International is global supplier and technology leader of advanced thermal processing equipment and processes to the electronics and alternative energy manufacturing markets. BTU equipment is used in the production of printed circuit board assemblies and semiconductor packaging as well as in solar cell and nuclear fuel manufacturing. BTU has operations in North Billerica, Massachusetts and Shanghai, China with direct sales and service in the USA, Asia and Europe.

Information about BTU International is available at www.btu.com.

May 16, 2017 -

BTU Announces NextFlex as Its Newest Demo Site for the PYRAMAX Reflow Oven

May 02, 2017 -

BTU International Receives 30th Award for Advanced Thermal Processin

Apr 25, 2017 -

BTU’s New Dual Chamber Reflow System Awarde d during NEPCON China 2017

Apr 22, 2017 -

BTU to Demo the Updated WINCON Control System at SMT Hybrid Packaging 2017

Mar 16, 2017 -

BTU to Demo Its Dual Chamber Reflow Oven & Industry 4.0 Advances at NEPCON China

Mar 09, 2017 -

BTU to Show New WINCON Interface Features at Southern Manufacturing

Feb 12, 2017 -

BTU to Participate in “Making Reflow Ovens Smart” Panel Session at APEX

Jan 10, 2017 -

BTU Set to Launch the PYRAMAX ZeroTurn Dual Chamber System at APEX

Sep 12, 2016 -

BTU & SMarTsol to Demo RecipePro on PYRAMAX Oven at SMTA Guadalajara

Aug 31, 2016 -

Visit BTU at SMTAI to Learn How Its Recipe Prediction Tool Reduces Cost of Ownership

203 more news from BTU International »

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Jul 19, 2017 -

Logic PD Appoints Eric Wilkowske as Vice President of Products, Design & Engineering

See electronics manufacturing industry news »

BTU International announcing that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium news release has been viewed 723 times

  • SMTnet
  • »
  • Industry News
  • »
  • BTU International announcing that it joined the Advanced Research in Electronics Assembly (A.R.E.A.) Consortium
2-Part Mixing Pump

SMT equipment