Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMs and IC cooling applications, will showcase its DF-2000 Series Dry Film Negative Photoresists in booth #14 at the International Wafer Level Packaging Conference (IWLPC), scheduled to take place November 6-7, 2013 at the Doubletree Hotel in San Jose, Calif. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
DF-2000 series films were developed for consistent photo speeds with +/- 3 percent critical dimension target and are available in various thickness formats from 5 to 50um, +/- 5 percent. The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The DF-2000 series films are tougher (less brittle) than most negative photoresists in the market with a glass transition temperature of 145°C (by DMA Tan Delta) and a moderate modulus of 4.5 GPa at 25°C. The cured chemistry is hydrophobic in nature providing for chemical and moisture resistance. DF-2000 series films are compatible with and can be used in contact with the EMS line of spin coatable photoresists.
Company representatives will be available at the show to discuss Engineered Materials Systems’ full line of negative photoresists, conductive adhesives and circuit assembly materials for MEMS and other wafer level packaging applications. To learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, stop by booth #14 at IWLPC or visit
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive,printed electronics and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future.
For more information, visit www.emsadhesives.com.