SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications

Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications

Sep 24, 2013

 CA-102 Conductive Adhesive

Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.

CA-102 has a moderate glass transition temperature (Tg) and modulus. The adhesive has an optimized rheology for screen printing and can be needle dispensed by time-pressure, auger or positive displacement. CA-102 is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces. CA-102 is ideal for applications requiring lower stress, lower temperature processing or elimination of Pb in solder.

CA-102 is the latest addition to Engineered Material Systems’ extensive line of electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonic applications.

For more information about the CA-102 Electrically Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future.

For more information, visit www.emsadhesives.com.

Jun 11, 2018 -

Engineered Material Systems to Showcase Next Generation Electrically Conductive Adhesives at Intersolar Europe

May 08, 2018 -

Engineered Material Systems to Showcase Conductive Adhesives for Next-Generation Solar Modules at the SNEC PV Power Expo

Mar 12, 2018 -

New Non-Conductive Die Attach Adhesive for Image Sensors & Circuit Assembly Applications

Mar 08, 2018 -

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Jan 28, 2018 -

Engineered Material Systems Introduces a New Two-Component Epoxy Encapsulant (506-03A/B)

Jan 28, 2018 -

Engineered Material Systems to Showcase Jet Dispense SMT at IPC APEX EXPO

Dec 05, 2017 -

Super Thin Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Dec 03, 2017 -

Engineered Material Systems Introduces a New Low-Temperature Cure Electrically Conductive Adhesive

Oct 22, 2017 -

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

58 more news from Engineered Materials Systems, Inc. »

Jun 18, 2018 -

About the creation of communication standards to enable machine to machine cooperation in SMT lines by ELS

Jun 18, 2018 -

Online SMT Auction July 5th – July 11th, 2018

Jun 17, 2018 -

SMT Nuremberg Pays Off for Europlacer & Speedprint.

Jun 17, 2018 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $22,500 in Scholarships during Annual Golf Outing

Jun 17, 2018 -

New Low-Temperature Solder Paste from SHENMAO

Jun 17, 2018 -

Jeremy Zhou Appointed to China Regional Sales Manager for VJ Electronix, Inc.

Jun 17, 2018 -

IPC’s PCB Technology Trends Study Underway, OEM Survey Open Until July 6

Jun 17, 2018 -

Join Scienscope this Week at the SMTA Upper Midwest Expo

Jun 17, 2018 -

IPC Hand Soldering Regional Qualification Competition Winner Crowned at SMT Hybrid Packaging 2018

Jun 17, 2018 -

DDM Novastar Welcomes New Director of Engineering

See electronics manufacturing industry news »

Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications news release has been viewed 9 times

  • SMTnet
  • »
  • Industry News
  • »
  • Engineered Material Systems Releases New Conductive Adhesive for Solder Replacement Applications
used pcb assembly equipment - lel semi

Large PCB Dispensing System