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Nihon Superior’s Keith Sweatman to Introduce Novel Lead-Free Alloy for Elevated Temperature Service at SMTA International

Sep 17, 2013

 Keith Sweatman

Nihon Superior, a supplier of advanced soldering materials to the global market, announces that its Senior Technical Advisor Keith Sweatman will present at SMTA International, which is scheduled to take place October 12-17 at the Fort Worth Convention Center in Texas. The paper, entitled Modified Hypereutectic Sn-Cu-Pb-free Solder for Power Semiconductor Die Attach, will be presented during technical session HE3 “Power Electronics Packaging” on Monday, October 14 from 1:30-3 p.m. in room 202A.

This session will focus on how increased emphasis on energy has resulted in the proliferation of power electronics in hybrid electric and fully-electric vehicles. Examples of automotive applications include the Toyota Prius Hybrid and the high profile launch of the Tesla Model S FEV. Power electronics modules in automotive applications often require high power dissipation and continued operation at high temperature. In this session, several packaging technologies targeted for power electronics applications will be presented. Technologies discussed will include embedded components, sintering technologies and hypereutectic solder for die-attach.

Mr. Sweatman’s paper will make the case that while it has been assumed that a lead-free solder for attaching power semiconductor dies would have to have a melting range similar to that of the Pb-5Sn solder it would be replacing, there is evidence that it is sufficient that the solder maintain adequate strength in long term exposure to temperatures up to about 200°C, the typical maximum reached in the joint in these components.  Building on a study  by University of Queensland on the refinement of the grain size of primary Cu6Sn5 intermetallic compound the team in the Nihon Superior R&D Center have developed an alloy based on their popular Sn-Cu-Ni lead-free solder that contains 10 to 14 times more copper than the lead-free solders most commonly used for PCB assembly.  The resulting high volume fraction of stable finely-dispersed intermetallic compound significantly increases the strength of the alloy at elevated temperature.  The alloy has already been proved in in commercial scale evaluations and promises a cost effective solution to the demand for lead-free power semiconductors.

For further information: info@nihonsuperior.co.jp


Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.
 

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