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Essemtec Brings Paraquda 4C with PFV to SMTA International

Sep 14, 2013

Piezo flow valve for silver-filled epoxies and solder pastes

Piezo flow valve for silver-filled epoxies and solder pastes

Essemtec, the Swiss manufacturer of production systems for electronic assembly and packaging, will exhibit in booth #827 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Company representatives will showcase the Paraquda together with the newly implemented Piezo Flow Valve (PFV).

Essemtec’s Paraquda SMT pick-and-place machine combines a large feeder capacity (up to 240 intelligent feeders), fast programming and changeover while the machine is running, with the ability to quickly place any component from 01005 up to 3.15 x 2.75" (80x70 mm) including fine pitch, BGA, CSP or flip chips. Designed to fulfil the requirements of high-mix SMT production, the Paraquda’s placement head is equipped with four component placement spindles, each one with its own vertical and rotation drive system, which can be controlled individually.

The Paraquda is operated and programmed using ePlace, Essemtec’s intuitive and graphical software. Additionally, the newly developed hyQ-feeders (available for all common tape sizes) allow four components to be picked up simultaneously; pick up position is reproducible within a few micrometers. This, together with the indexing time of only 60 ms/4mm step, increases the machine’s placement speed by more than 25 percent. An integrated cutter for tape and cover tape is available, and an active retracting system ensures reliable, continuous feeding.

Thanks to the SMART solution concept of Essemtec, the Paraquda also can be equipped with a fully featured dispensing option, which extends the placement machine’s application range: In addition to placing 10,200 components per hour (IPC rating), the Paraquda now can dispense up to 20,000 glue or paste dots per hour. The new dispensing option provides the Paraquda pick-and-place with all the features of a modern dispensing machine, including a needle height calibration station and a fully automatic needle cleaning system. With the SMART solution, Essemtec offers a fully modular hardware concept and a powerful SMART software suite to meet all the requirements of a modern electronic manufacturing environment.

At the show, the Paraquda will be shown with the newly implemented PFV that has been developed for silver-filled epoxies and solder pastes. The special valve sealing technique allows dispensing of small dots of thick fluids. The PFV is a sliding valve with piezoelectric actuators. It is possible to influence the metering mass as well as the drop diameter by means of the pressure, temperature, opening time and the needle diameter. Undercuts causing gas bubbles and thus improper meterings can be reduced due to the special connecting geometry.

For more information about Essemtec's flexible production equipment, visit the company in booth #827 at SMTAI or on the Web at www.essemtec.com.


The Swiss equipment manufacturer Essemtec is the market leader for flexible production systems for electronic assembly and packaging. Essemtec has been developing, manufacturing and marketing equipment for all processes in the electronics industry since 1991: such as printers, jet dispensers, pick-and-place and soldering systems. Manual, semiautomatic and fully automatic systems are available. The range of products also includes transportation and storage systems, as well as software solutions for planning, simulation optimization and documentation of manufacturing. All Essemtec systems are optimized for maximum flexibility. Users can switch from one product to another quickly, making maximum use of available production capacity.

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