SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from MIRTEC Corporation

MIRTEC to Exhibit Award-Winning Line of 3D AOI and SPI Inspection Systems at SMTAI 2013

Sep 13, 2013

MS-11 In-Line SPI System.

MS-11 In-Line SPI System.

MV-3L Desktop AOI System

MV-3L Desktop AOI System

MIRTEC,The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems at SMTAI 2013 booth #722. This three-day event is scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

We at MIRTEC are very excited to present our award winning MV-9 2D/3D In-Line AOI Machine at SMTAI 2013,” stated Brian D’Amico, President of MIRTEC Corp. “This technologically advanced AOI machine is configured with MIRTEC’s revolutionary OMNI-VISION® 3D Inspection Technology which combines our exclusive 15 Mega Pixel 2D ISIS Vision System with our revolutionary Digital Multi-Frequency Quad Moiré 3D system to provide precision inspection of SMT devices on finished PCB assemblies.  Fully configured the new MIRTEC MV-9 machines will also feature four (4) Ten Mega Pixel Side-View Cameras in addition to the 15 Mega Pixel Top-Down Camera.

MIRTEC also will exhibit the MS-11 In-Line SPI System. This highly advanced SPI system uses Shadow Free Moiré Phase Shift Imaging Technology to inspect solder paste deposition on PCBs post screen print. The MS-11 will inspect for; insufficient solder, excessive solder, shape deformity, shift of deposition and bridging. New at SMTAI 2013, the MS-11 will be configured with a 15M pixel ISIS Vision System for enhanced image quality, superior accuracy and lightening fast inspection rates. The MS-11 uses the same robust platform as MIRTEC’s MV-7 Series. Inspection heads are interchangeable between the two systems, adding ultimate flexibility to the inspection process. 

The MIRTEC MV-3L Desktop AOI System is the industry’s most widely accepted five camera desktop AOI system. This system is configured with one Top-Down View Ten Mega Pixel camera with a Precision 13.4 Micron Telecentric Compound Lens and four (4) Ten Mega Pixel Side-View Cameras. It also features the Intelli-Beam Laser System. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability.

MIRTEC has earned a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment,” continued D’Amico, “We look forward to welcoming visitors to our booth #722 during the three day event.”

MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry.  For further information, please visit

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MIRTEC to Exhibit Award-Winning Line of 3D AOI and SPI Inspection Systems at SMTAI 2013 news release has been viewed 1118 times

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