Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, will exhibit in Booth #504 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Company representatives will showcase a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, including lead-free die attach, void minimization, environmental protection, and process yields.
SN100C P504 D4 is a general purpose solder paste that can be used in a wide range of electronics assembly applications. This product has improved performance compared with previous products in this series making it ideal for high density fine-pitch applications. SN100C P504 D4 can usually be reflowed with a thermal profile similar to that used for the reflow of tin-silver-copper paste.
In the development of SN100C P604 D4 lead-free and completely halogen-free solder paste, Nihon Superior found a way of formulating a solder paste that complies with the requirement of the EU RoHS Directive and does not use any chemicals requiring special registration under the EU REACH legislation without compromising performance and reliability. This ambitious goal was achieved by choosing a series of non-halogenated activators that are effective at each stage of the thermal profile commonly used with halogenated solder pastes.
SN100C (031) is a general purpose flux-cored lead-free solder wire that offers improved productivity. The solder wire provides fast wetting, resulting in faster soldering. In addition to offering good wetting and spread, SN100C (031) features low flux spattering, high insulation resistance and fast sequential soldering.
Alconano Nano-Silver Paste is based on a patented technology that makes it possible to effect joints to most metals as well as Si and SiC at low sintering temperatures, if necessary in nitrogen, without the nitrous or sulphurous residues that are the by-products of the sintering of some other nano-silver pastes. The highly active surface of the nano-silver particles and the consequent strong capillary forces makes it possible to achieve strong bonds with high electrical and thermal conductivity at low temperature without the need for external pressure. By controlling the sintered microstructure the modulus of the joint can be tailored to accommodate strains arising from CTE differences between a die and a substrate without overstressing the die. After sintering, the melting point of the silver returns to the 961°C of bulk silver so that the joint retains its integrity at high operating temperatures. As such it is ideally suited to the attachment of power semiconductor dies that can achieve maximum efficiency at higher operating temperatures. The Alconano nano-silver pastes can be considered a Pb-free replacement for the >85% Pb solders that are currently used in this application.
For more information about Nihon Superior’s new solder pastes and lead-free products, meet company representatives in Booth #504 at the show or visit the company on the Web at www.nihonsuperior.co.jp/english.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products, Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries, and the United States, and formed business partnerships with companies in other markets.