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Cobar to Exhibit New Solder Wire and Paste Technologies at SMTA International

Sep 13, 2013

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit in Booth #605 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas. Representatives from Cobar will display the company’s latest solder wire and paste technologies, including BRILLIANT B2012 Solder Wire and OT2 Solder Paste.

Balver Zinn’s BRILLIANT B2012 solder wire is halide-free, rosin based and designed for manual and robotic soldering. B2012 is odorless and shows excellent soldering and wetting performance. The no-clean, halide free solder wire was developed for lead-free rework and touch-up. B2012 is available in the alloys SN100C® , SAC305 (SN97C) and SAC387 (SN96C) with a standard flux content of 2.2 percent. Balver Zinn wires are available in diameters from 0.3 to 3.5mm.

OT2 is Cobar’s latest solder paste technology that is specially developed to meet continuously increasing customer requirements. The OT2 solder paste’s optimized rosin based chemistry offers the best printing and wetting properties in Pb-free as well as SnPb. Because of the uniform paste flux technology for SnPb and Pb-free, it is easy to switch from SnPb to Pb-free. The solder paste is designed to achieve printing speeds up to 250 mm/s for the most demanding throughputs. The combination of solvents and activators used in this paste returns a large process window for the reflow process. High yields can be achieved with fast conveyor speeds and short cycle times.


Balver Zinn and Cobar offer solder bar, solder wire, solder flux, gel flux, cleaner and solder paste. For more information about the company’s complete range of solder materials, visit www.balverzinn.com or www.cobar.com.

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