SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Automated Circuit Design (ACD)

Texas-Based EMS Provider to Highlight PoP Assembly Services at SMTA International

Sep 12, 2013

ACD, a leading supplier to the electronics industry and leader in Package-on-Package (PoP) assembly, will exhibit in Booth #206 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

ACD’s assembly business model is geared toward supporting high-mix, high-technology assembly from prototypes through low-to-mid volume production. With a focus on high-end technology, ACD is staffed with two shifts to respond to a variety of products, markets, and deliveries. For more than 28 years, ACD has supported the printed circuit board (PCB) industry in a variety of ways; from design to laser photoplotting, to supporting engineering software, to final test. ACD offers the support required to get products to market as quickly as possible.

ACD’s functional testing verifies that each of the various product capabilities defined in the design specification or test specification meet customer requirements. This is instrumental to providing ACD’s customers with quality, defect free assemblies. ACD works closely with its customers and the Functional Test Department to develop an accurate test for each assembly.

With its medium to high-volume Juki lines, ACD averages 1.5 turns per day. The Juki lines also have this capability, and this flexibility allows ACD to process complex builds, including PoP, back-to-back with very little down time. On the MYDATA lines, the company usually completes up to four turns per day because these lines perform prototypes or small batch runs.

For more information about ACD’s design and contract assembly services, or the company’s world-class quality management system, meet company representatives at SMTA International or visit

Founded in 1984, ACD is an AS9100 and ISO 13485 certified full service EMS company. The company’s services comprise complete board layout, DFM/DFA capability, printed circuit fabrication, component procurement, thru-hole, SMT and part-on-part mixed technology assembly, box build, rework, flying probe, functional and JTAG test, and development.

For more information, visit

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