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Engineered Material Systems Debuts DB-1588-3 Low Cost Conductive Adhesive at EU PVSEC 2013

Sep 10, 2013

Engineered Material Systems, a leading global supplier of conductive interconnect materials for photovoltaic applications, will introduce its DB-1588-3 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in Hall 2, stand E6 at the 28th European Photovoltaic Solar Energy Conference scheduled to take place October 1-3, 2013 at Parc des Expositions Paris Nord Villipinte in Paris, France.

DB-1588-3 is designed to make contact from vias or other conductors on the solar cells to the back contact sheet. The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to back contact metallizations during damp heat exposure. DB-1588-3 is designed to cure through the encapsulant lamination and cure process. This material is approximately 50 percent lower cost than standard silver filled adhesives and is lower cost than the current EMS DB-1588-2 product currently used for manufacturing back contact solar modules.

Company representatives will be available at the show to discuss Engineered Materials Systems’ full line of conductive adhesives designed for photovoltaic applications. To learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, stop by hall E2, booth E6 or visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

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