SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Ascentech to Exhibit Gensonic UltraSonic Stencil Cleaner, and Solder Saver at SMTA Capital Expo & Tech Forum

Ascentech to Exhibit Gensonic UltraSonic Stencil Cleaner, and Solder Saver at SMTA Capital Expo & Tech Forum

Aug 28, 2013

The Gensonic is a manually-operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.

The Gensonic is a manually-operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.

Ascentech LLC, the North American distributor for GEN3 Systems Ltd., will exhibit the Gensonic UltraSonic Stencil Cleaner and the new Solder Saver at the upcoming SMTA Capital Expo & Technical Forum, which will be held September 10th, 2013 at the Johns Hopkins University/Applied Physics Lab, 1110 Johns Hopkins Rd., Laurel, MD 20723. Show Hours are from 9am-3:30pm.

The Gensonic is a manually-operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.

Printed solder pastes tend to compact and trap particles into aperture corners; lead-free solder pastes, that are less dense, tend to demonstrate this tendency even more. To clean effectively requires both "chemicals" and mechanical agitation. Direct ultrasonic contact cleaning is the ultimate way to clean SMT stencils with the minimum amount of cleaning chemistry.

It is generally recognized that most soldering defects have their origins in the solder paste printing process,” says Ascentech partner Randy Allinson. “A clean stencil is one of the best means of minimizing solder paste printing defects. This is perhaps why the demand for effective, reliable SMT stencil cleaning solutions is constantly increasing.”

The Solder Saver is a hand held, compact system for separating Dross from good solder. The unit easily reduces hardened dross material to oxide powder making it possible to remove the dross oxide waste from the solder pot, leaving valuable solder in the pot.


Ascentech, LLC managing members Randy Allinson and Gregory Alexander formed the company in 2000 to provide products to enhance productivity, quality and reliability to the electronic assembly and PCB fabrication industries. Ascentech is the North American Distributor for GEN3 Systems, and also supplies the industry with other product reliability test equipment including the MUST III -Solderability test systems (wetting balance), Auto-SIR –Surface Insulation Resistance test, CM-Series - Cleanliness test (ionic contamination), and the SPA-1000-Solder Paste Analyzer. To learn more about the company visit www.ascentechllc.com.  For sales and technical information, contact Randy Allinson, Ascentech, 127 Goose Hill Rd., Chester, CT, 06412: Tel 860-526-8903, e-mail rallinson@snet.net

Jul 16, 2017 -

Ascentech LLC Announces Sales Milestone: More than 100 Gensonic Stencil Cleaners in North America

Jul 06, 2017 -

Ascentech will Exhibit Optilia, Inspectis and GEN3 Products at SMTA Ohio Expo & Tech Forum July 13

Jun 01, 2017 -

Ascentech will Exhibit Optilia, Inspectis and GEN3 Products at SMTA Empire Expo & Tech Forum June 15

May 15, 2017 -

ASCENTECH, LLC Named North American Distributor for New Inspectis Optical Inspection Line

Jan 30, 2017 -

ASCENTECH, LLC Named North American Distributor for New Inspectis Optical Inspection Line; Exhibits at IPC/APEX 2017

Jan 19, 2017 -

ASCENTECH, LLC Exhibiting Contamination Testing and Optical Inspection Solutions at IPC/APEX 2017

Oct 16, 2016 -

Ascentech to Introduce Remarkable New INSPECTIS System at Two SMTA Chapter Shows in the Northeast

Sep 08, 2016 -

Ascentech to Exhibit Optilia Inspection, GEN3 Systems Solutions at SMTAI 2016 in Booth #219

Jul 30, 2016 -

Ascentech to Exhibit Optilia Inspection, GEN3 Systems Solutions at SMTA Ohio Expo & Tech Forum August 4th, 2016

Feb 15, 2016 -

ASCENTECH to Introduce GEN3 CM+ Systems at IPC/APEX 2016

7 more news from Ascentech LLC »

Aug 23, 2017 -

Count On Tools Inc. Expands Panasonic Nozzles for AM100 Placement Equipment

Aug 23, 2017 -

Saelig Introduces Industrial Raspberry Pi Controller ComfilePi

Aug 23, 2017 -

Vi TECHNOLOGY Combines 3D Inspection with SIGMA Link for Smart Factories

Aug 23, 2017 -

Hanwha Techwin and ESE Partner to Bring Customers Value and Versatility

Aug 23, 2017 -

Laser Design CyberGage®360, Automated 3D Scanning & Inspection System Adopted by Proto Labs in Their State-of-the-Art Metrology Lab

Aug 23, 2017 -

ZESTRON to Feature HYDRON® Technology at SMTAI

Aug 23, 2017 -

The Hermes Standard: Viscom working on first field tests

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

See electronics manufacturing industry news »

Ascentech to Exhibit Gensonic UltraSonic Stencil Cleaner, and Solder Saver at SMTA Capital Expo & Tech Forum news release has been viewed 1281 times

  • SMTnet
  • »
  • Industry News
  • »
  • Ascentech to Exhibit Gensonic UltraSonic Stencil Cleaner, and Solder Saver at SMTA Capital Expo & Tech Forum
PCB machines

 Reflow System