SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


IPC Technology Market Research Conference Agenda Announced Thought Leaders to Deliver Insights Into Market and Technology Trends

Aug 13, 2013

Experts from industry giants, government and academia will take center stage September 25–26 at the IPC Technology Market Research Conference (TMRC) in Chicago. With the theme, “The Next Generation: Creating the Electronics Industry of the Future,” the conference is designed to help electronics industry technologists, decision makers and other executives tackle the demands of new and emerging technologies.

“The TMRC, more than any other event, presents a holistic look at the industry and helps us understand how trends affect all segments of the value chain,” said Yvonne Julian-Hargrove, account executive, Dow Coating Materials and Epoxy Products. “It makes the connection between technology and market developments.”

This year’s TMRC opens with a keynote by New York Times columnist and author Gene Marks, followed by presentations from technologists and thought leaders from M.I.T., DuPont, Lockheed Martin, Delphi, Isola and other leading organizations.

Presentations include sessions on innovations in nanotechnology with Patrick Murray, Nanophase Technologies; automotive technology developments with Henry Sanftleben of Delphi Electronics and Safety; new materials in electronics with Phil Plonski, Prismark; the impact of graphene presented by Tomas Palacios, Massachusetts Institute of Technology; and highlights of the 2013 IPC Technology Roadmap with Marc Carter, IPC.A session on how suppliers are responding to the technology needs of new products will feature George Milad of Uyemura International Corp., addressing wet chemistry; Doug Trobough of Isola SARL, discussing laminate; and Jim Watkowski of MacDermid, Inc., presenting on imaging, metallization and plating.

The second day of the conference opens with keynote speaker Robert Fry of DuPont Corporate Plans, who will discuss the global economic forecast. Other sessions include a look at trends in 3-D packaging featuring Jan Vardaman of TechSearch International; the outlook for the military electronics market with James Libous, Lockheed Martin Corporate Engineering and Technology; and a presentation about the outlook for the PCB industry in China, with Hayao Nakahara of N.T. Information Ltd.

Beyond the high-level discussions of technology and market trends, the meeting offers a unique opportunity to build relationships with an elite group of industry executives. “We are excited to see the TMRC coming back. It is one of the best networking meetings in the industry,” said Michael Moisan, vice president of Global Technology, TTM Technologies.

The TMRC is co-located with the IPC Management Meetings, which will take place on September 24. More information about the TMRC, including a full agenda and registration options, is available at www.ipc.org/tmrc.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

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