SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Speedline Technologies, Inc.


MPM® Momentum® Compact Printer Boosts Throughput with Back-to-Back Configurability

Aug 07, 2013

The Dual Lane BTB-configurable MPM Momentum Compact printer satisfies both, and in addition, delivers high speed and high accuracy (wet print: 18µm @ 6ó, Cpk>2) to maximize yields and product quality. In fact, the Momentum Compact delivers the highest throughput for its footprint in the industry.

The Dual Lane BTB-configurable MPM Momentum Compact printer satisfies both, and in addition, delivers high speed and high accuracy (wet print: 18µm @ 6ó, Cpk>2) to maximize yields and product quality. In fact, the Momentum Compact delivers the highest throughput for its footprint in the industry.

Electronics manufacturers with high volume demands and floor space at a premium are increasingly employing Back-to-Back (BTB) configurations for their PCB assembly equipment to maximize space efficiency without sacrificing throughput. The Dual Lane BTB-configurable MPM Momentum Compact printer satisfies both, and in addition, delivers high speed and high accuracy (wet print: 18µm @ 6ó, Cpk>2) to maximize yields and product quality. In fact, the Momentum Compact delivers the highest throughput for its footprint in the industry.

Back-to-Back processing allows a manufacturer to fit more lines in a given factory footprint. It is most often used by makers of consumer electronics, and automotive manufacturers. For BTB, the Momentum Compact is supplied in Dual Lane configuration and can be equipped with optional shuttle conveyors. When coupled with two SPI systems and mounters in a dual lane BTB configuration, the result is a line capable of independent production in each lane. The Momentum Compact is designed with the potential for BTB setup in mind, as full accessibility for service and maintenance is provided from the front of the machine, as is its unique slide-out solvent reservoir.

The MPM Momentum Compact printer is 30% smaller overall than the standard Momentum, and can be equipped with the MPM EnclosedFlow™ enclosed media printing system, a patent-pending solution offering superb fine pitch printing results with paste volumes over 50% for 150 micron apertures with a 0.35 area ratio and more than 50% materials (paste) savings over metal blades.

Configured stand-alone or in-line, the Momentum Compact uses the SPI Print Optimizer, which monitors and auto-corrects X, Y, and è registration ‘on the fly’ to prevent print defects. The Momentum Compact is equipped standard with RapidClean™, MPM’s high speed stencil cleaning solution that can save up to $10,000 USD in wiper paper per year. Options include Edgeloc™ board snugging, Auto Paste Dispenser, Paste Height Monitor, EnclosedFlow™ Print System, 2D Contrast and Enhanced Inspection, SPI Print Optimizer, Quik-Tool™ Board Support, AccuCheck™ Print Capability verification, and more.


Speedline Technologies is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries.  Based in Franklin, Massachusetts, USA, the company markets five best-in-class brands:  Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support and training solutions. For more information about Speedline Technologies visit www.speedlinetech.com.

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