The SMTA announced that the Lead-Free Soldering Technology Symposium will be held on October 17, 2013 as a focused symposium at SMTA International in Fort Worth, TX. The scope of this year's symposium is on the findings of three industry consortia related to the advancement of Lead-Free technology. These efforts are proving to be particularly crucial to consumer products as well as aerospace, defense, and high reliability sectors of the electronics industry as designers and process engineers develop Pb-free solutions for their product space.
In the first session, the High Density Packaging Users Group (HDPUG) will present on studies that examine the effects of higher Pb-free process temperatures on PCB reliability. The second session will include presentations from the iNEMI consortium on both performance of new Pb-free alloys and Au embrittlement. The third session of the symposium will describe the efforts within Universal Instrument’s Advanced Research in Electronics Assembly (AREA) consortium regarding the reliability of fine pitch assemblies, Pb-free interconnections, and fine pitch solder joint reliability. The fourth session will focus on Pb-free processing. The symposium will be brought to a close with an excellent discussion of the next-generation of no-clean Pb-free pastes that target fine pitch applications.
Papers will be presented from Alcatel-Lucent, Agilent Technologies, Binghamton University, Celestica, Hewlett Packard, IBM Corporation, iNEMI, Intel Corporation, and Universal Instruments Corporation among others.
Details of the Lead-Free Soldering Technology Symposium can be found at http://www.smta.org/smtai/symposium.cfm#lf or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or email@example.com.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.