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  • NEW 3D AOI, SPI AND LED INSPECTION SYSTEMS FROM MIRTEC TO BE DISPLAYED DURING NEPCON SOUTH CHINA 2013

NEW 3D AOI, SPI AND LED INSPECTION SYSTEMS FROM MIRTEC TO BE DISPLAYED DURING NEPCON SOUTH CHINA 2013

Jul 29, 2013

 MIRTEC Co., Ltd. “The Global Leader in Inspection Technology,” today announced that it will premier its complete line of 3D AOI, SPI and LED inspection systems in Booth # A-1E45 at NEPCON South China 2013, scheduled to take place August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China. MIRTEC has gained a solid reputation in the industry by providing unprecedented performance, quality and cost-effectiveness to the inspection environment. Company representatives will demonstrate the MV-9 Series 25 Mega Pixel 2D/3D AOI System, MS-15 Series 25 Mega Pixel 3D SPI System and MV-9UP Series LED Package 2D/3D Inspection System.

MIRTEC’s all new MV-9 2D/3D CoaXPress In-Line AOI systems are configured with MIRTEC’s revolutionary OMNI-VISION® 3D Inspection Technology that combines 25 Mega Pixel 2D Inspection with advanced Digital Multi-Frequency Moiré 3D inspection to provide precision inspection of SMT devices on finished PCB assemblies.  The MV-9 systems may be configured with a state-of-the-art CoaXPress 25 Mega Pixel top-down camera system.  This proprietary camera system is designed and manufactured by MIRTEC for use with the company’s complete product range of inspection equipment.

MIRTEC’s revolutionary CoaXPress Camera Technology is capable of providing data transfer rates of 25 Gbit/Second making the MV-9 the fastest 2D/3D AOI system in the world! MIRTEC’s technologically advanced Six Phase Lighting System uses multi-color LEDs to illuminate inspection areas from six different angles providing superior solder joint characterization and co-planarity inspection of leads on gull-wing devices.  MIRTEC’s revolutionary Digital Multi Frequency Quad Moiré Technology provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four (4) Moiré Inspection Probes.  This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.

The MIRTEC team looks forward to welcoming visitors to Booth #2B21 during the event. For more information about MIRTEC, call +86-512-8918-5351 or e-mail Sales@mirtec.com.


MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry.  For further information, please visit www.mirtec.com.

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