SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Get the Latest Fast Drying Stencil Cleaner from Kyzen at NEPCON South China 2013

Get the Latest Fast Drying Stencil Cleaner from Kyzen at NEPCON South China 2013

Jul 29, 2013

Kyzen will showcase its newest fast-drying stencil cleaner along with its semi-aqueous high-lead cleaner in Booth 2F10 at NEPCON South China, August 27-29, 2013 at the Shenzhen Convention & Exhibition Center in China.

KYZEN® E5615 is an innovative aqueous-based stencil cleaner. It removes unreflowed solder paste from stencils and other related equipment, without requiring a rinse. E5615 addresses the market need for a stencil cleaner that dries quickly, using only airflow at ambient temperature, and without staining.

Also on display, MICRONOX® MX2305 is a semi-aqueous solvent blend designed to remove difficult high-lead flux
and solder paste residues. The neutral pH provides low impact on the environment while maintaining superior cleaning results. MX2305 offers excellent compatibility including Nitride, PI and Silicon, and is designed for all immersion and wet process cleaning tools.

MICRONOX® MX2305 is available in five, 25 and 200 liter (one, five, and 55 gallon) containers and KYZEN® E5615 is available in 25 and 200 liter (five, and 55 gallon) containers. In addition to MICRONOX® MX2305 and KYZEN® E5615, Kyzen offers a full line of precision cleaning chemistries to address a vast range of cleaning challenges.

KYZEN® and MICRONOX® are registered trademarks in the United States and other countries.


Kyzen specializes in precision cleaning chemistries for electronics, advanced packaging, metal finishing and aerospace applications. Kyzen’s industry expertise and dedicated customer support provide integrated cleaning process solutions that meet any cleaning challenge. Founded in 1990, Kyzen is the leading provider of environmentally responsible, RoHS compliant cleaning chemistries to industries worldwide. For more information, please visit www.kyzen.com.

 

Aug 15, 2017 -

KYZEN to Show Real-Time Data Analyst for All Cleaning Processes at SMTAI

Aug 06, 2017 -

Dr. Mike Bixenman Receives Best Paper Award for His Presentation at ICSR

Jul 17, 2017 -

KYZEN to Show First of Its Kind, Real-Time Concentration Monitoring & Reporting System at NEPCON South China

Jun 13, 2017 -

SEMICON West

May 31, 2017 -

KYZEN Expands EU Facilities to Meet Growing Demand

May 22, 2017 -

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR

May 21, 2017 -

Cleaning & Coating Conference in Amsterdam

May 18, 2017 -

KYZEN Exhibits at SMTA Toronto Expo / ICSR

Apr 26, 2017 -

KYZEN Awarded for New Industry 4.0 Enabled KYZEN ANALYST™ at NEPCON China

Apr 22, 2017 -

KYZEN’s Newest Innovation, the KYZEN ANALYSTTM, Will Be Launched at SMT Hybrid Packaging 2017 this May!

415 more news from KYZEN Corporation »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

Get the Latest Fast Drying Stencil Cleaner from Kyzen at NEPCON South China 2013 news release has been viewed 539 times

  • SMTnet
  • »
  • Industry News
  • »
  • Get the Latest Fast Drying Stencil Cleaner from Kyzen at NEPCON South China 2013
Large PCB Dispensing System

Capillary Underfill process