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Evolving Technologies Summit Focuses on Printed Electronics, Packaging Technology, and Materials at SMTA International

Jul 23, 2013

The SMTA announced that the Evolving Technologies Summit will be held on October 14, 2013 as a focused symposium at SMTA International in Fort Worth, Texas.  The purpose of the summit is to present the key issues in Printed Electronics, Advanced Packaging Technology, and Materials Innovations in order to gain insight about the way technology will change in the future. The event is organized by Reza Ghaffarian, Ph.D., Jet Propulsion Laboratories, Lars Böttcher, Fraunhofer Institute IZM, and Steve Greathouse, Plexus Corp. 

The morning session takes on the topic of Printed Electronics Technology Status and Implementation Challenges. Charles Woychik, Ph.D., Invensas Corporation, will then provide an exciting keynote lunch presentation on Emerging 3D and TSV Packaging Technology. The afternoon session analyzes material concerns such as the mining of rare earths and the opportunity to recycle these materials, whether nano-copper can be a replacement for solder, and whether hygroscopic silica gel can be used to dissipate high amounts of heat in short time periods.

The Summit will end with a panel discussion. The Panel will present the status of new advanced technologies, then discuss and debate timely topics including challenges in active-embedded technology, 3D technology, use of through silicon via (TSV), nanomaterials, EMS challenges, and Pb-Free for high reliability applications.

Details about the Evolving Technologies Summit and SMTA International can be found online at http://smta.org/smtai/symposium.cfm#et or contact SMTA administrator JoAnn Stromberg: 952-920-7682 or joann@smta.org.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

 

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