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SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)

IPC APEX India Technical Conference to Highlight Pathways for Growth in the India Electronics Manufacturing Future

Jul 19, 2013

 IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India. A global leader among standards-developing organizations in electronics manufacturing, IPC brings its technical expertise to provide a pathway for growth to manufacturers in India. IPC APEX India will offer professional development workshops on 26–29 August, as well as a technical conference and exhibition on 27–29 August.

The IPC APEX India technical conference features paper presentations that reveal new research and innovations in the electronics manufacturing industry. Attendees will have the opportunity to interact with the experts who are charting the course for tomorrow’s technology.

The three-day technical conference kicks off on Tuesday, 27 August, with two sessions on counterfeiting: “Counterfeiting and Semiconductor Value Chain Economics,” by Rory King of IHS Inc., and “Electronics Engineering Management — Counterfeit Electronics Components,” by Seema Sabikhi of Barco Electronic Systems (P) Ltd. Focusing on advancements in design, Chandrakanth Gajawada of Sienna ECAD Technologies will discuss “Design for Assembly (DFA) Analysis,” and Mr. Giridharan and Ugra Mohan Roy, SAP AG, will present “Design and Development of Cost-Effective General Purpose FPGA Board.” The Tuesday sessions end with “TMV PoP (0.4/0.4mm Pitch) Assembly and Design Challenges,” by Ranilo Aranda of Flextronics Manufacturing (Zhuhai) Co. Ltd.

On Wednesday, 28 August, more presentations on industry innovations begin with “Developments in Advanced Packaging,” by TechSearch International’s Dr. Timothy G. Lenihan, followed by “SMT Reflow Profile Optimization in the Challenging Lead-Free World,” by Liyakathali K. of Indium Corporation. Other presentations include: “Alcohol-Passivated Nano-Silver Paste for Electronic Assembly,” by Wayne Ng of Nihon Superior Trading (S) Pte. Ltd.; “Alternative Alloys Rev TC,” by T.S. Lim of AIM Solder; “Low-Temperature SMT Process Implementation,” by Richard Puthota of Alpha Alent; and “Processes in the Area of Reliability and Quality Assurance, Environmental and ESD Compliance,” by SAP Labs India Private Ltd.’s Rajeev Deshpande. The day will conclude with “A Practical Approach to Assessing Human Body Electrostatic Discharge Potential,” by K. Rajkiran and C.S. Sudheendranath of Cir-Q-Tech Tako Technologies Pvt. Ltd.

The final day of the conference will take place on Thursday, 29 August, with must-attend presentations, including “Reliability & Quality Assurance — Manufacturing Quality Control,” by Irene Lim, ASM Assembly Systems Singapore Pte. Ltd.; “BGA Detachment — Failure Analysis,” by S. Anandha Sowmya, Avalon Technologies Pvt. Ltd.; and “Design Reliability Assessment and Improvement Through Accelerated Reliability,” by Shaik Hussain Basha, Crompton Greaves Ltd.
IPC APEX India will present the latest innovations from some of the world’s leading companies in the areas of printed board design and manufacturing, electronics assembly and test. During the next decade, the electronics products industry in India is projected to grow substantially, and IPC APEX India will show attendees how to grow with it. For more information and to register, visit

IPC ( is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

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