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SEHO Extends Soldering Seminar in Cincinnati with a Reflow Day

Jul 16, 2013

 SEHO North America, Inc. announces that it has extended the upcoming Selective Soldering Seminar from the SEHO Academy with a ‘Reflow Day.’ The two-day seminar is scheduled to take place September 18-19, 2013 in Cincinnati, Ohio.

The first day of the seminar will focus on the “Reflow Soldering Process – Now and in the Future.” Reflow experts Andreas Reinhardt, Stan Renals and Andrea Althaus will discuss new and existing trends in reflow soldering. A particular focus will be on void-free solder connections. Topics to be presented include:
Voids in Solder Joints – Cause and Effect
Reduction of Voids – Hyper Pneumatic Soldering Process
Latest Solder Paste Technology
Drying and Storage in Electronics Industry
Challenges in Reflow for Power Electronics
Soldering in Nitrogen Atmosphere … Do Quality Aspects Justify the Costs?
Intrusive Reflow Process

This seminar, as part of the successful SEHO Academy with more than 1,000 satisfied attendees worldwide, will highlight the latest technology for quality enhancement in surface mount production. As a result, participants will realize a higher level of profitability.

For more information about SEHO, visit www.seho.de.


Since its foundation in 1973, SEHO has become the worldwide contact partner whenever soldering is involved. Company solutions are based on performance, flexibility, efficiency and technical progress. SEHO’s business activities and production organization are oriented according to the principles of sustained future-compatible development and production of machines. As a result, all applicable environmental standards are complied with meticulously. With its systems, the company provides customers with a sustained and resource economizing production facility. It continuously develops its technology in order to provide customers with a competitive advantage. For more information, visit www.seho.de.

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