SMART Group, Europe’s largest technical trade association focusing on surface mount and related technologies, announces that it will present the webinar “Using Solder Spheres in Fine-Pitch Area-Array Rework Plus Manufacturing Quality Control” on Tuesday 20th August 2013 at 14:30.
This smart-e-webinar will be presented by SMART Group’s Technical Committee member Bob Willis and will examine the use of solder spheres during rework of BGA, CSP and other area-array packages as well as the quality control of the solder spheres for the assembly process and what areas should be specified.
Solder spheres are used in most area-array packages today. The size of solder spheres is decreasing along with the component pitch but they still provide a reliable interconnection due to the stand-off provided. There are different ways in which they may be placed during rework and repair as well as in the original manufacture of components. There are different sphere production methods based mainly on the size of termination required by the end user.
This webinar will provide attendees with the latest tips and techniques by focusing on the following topics:
» Reballing of area-array packages
» Methods of adding solder balls
» Use of solder spheres and benefits
» Solder alloy
» Sphere size
» Inspection and quality control
» Reliability of reballing packages
The webinar will last approximately 60 minutes plus questions and the price is £65 plus VAT. Before booking, and to get the best out of your webinar experience, please click here to read the smart-e-webinar guide.
The webinar is one in a series that is designed to provide a time-efficient way of keeping up to date on key regulations without leaving your desk. For additional information and details about how to book your place, contact Tony Gordon at 44 (0)1494 465217, e-mail firstname.lastname@example.org or visit http://www.smartgroup.org/events-diary/.