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International Conference on Soldering and Reliability (ICSR) Best of Conference Announced

Jun 26, 2013

 The SMTA announced Harald Grumm from Christian Koenen GmbH as the recipient of the Best of Conference Award for his presentation “The Potential of Stencil Technology – Choosing the Right Stencil Options to Maximize Yield and Earnings” at the 9th Annual International Conference on Soldering and Reliability, held May 14-17, 2013 at the Sheraton Toronto Airport, Ontario, Canada. 

Grumm's presentation introduced stencil technologies which help to increase the first pass yield of production lines for assemblies including fine pitches, small connection pads, and also components with a need for a high amount of solder volume (e.g. connectors, mechanical strained components, power components.) He discussed layout optimization, Step Stencil Technology, 3-D-Stencils, and Plasma Stencils.

A paper summarizing the work, along with other papers and presentations from the conference are available on the conference proceedings in the SMTA BookStore.

The technical conference featured 30 presentations on topics ranging from new low silver or silver free alloys to stencil printing to head-on-pillow defect and tin whisker mitigation.  Speakers represented companies including 3M, Alcatel-Lucent, BAE International, Blackberry, Celestica, Creation Technologies, Honeywell International, IBM, Indium Corporation, Rockwell Collins, Universal Instruments Corporation, Uyemura International, and schools including University of Seoul, University of Toronto, and SUNY Binghamton. 

Contact Patti Hvidhyld at 952-920-7682 or patti@smta.org with questions.


The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

 

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