SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Tresky AG

Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics

Jun 20, 2013

 Tresky, a global solutions provider for the microelectronics industries, announces that its wide range of die bonder products from simple and inexpensive to fully automatic are designed to provide simple, precise and reliable solutions for many applications within the microelectronics industry.

The company integrates “True Vertical Technology” into each of its product innovations. This technology provides numerous benefits, including:

• The bond axis is vertical to the work table, meaning the chip is always parallel to the substrate, resulting in high parallelism accuracy.
• Active power measurement, independent of the height Z in the force, is always measured, i.e. variations in the thickness of chip and/or substrate affect neither the parallelism nor the bond strength.
• “Bond Line Thickness,” i.e. the adhesive layer, can be accurately defined by measuring the chip and substrate thickness.
• The large Z-stroke also makes it possible to bond in deep cavities.
• Ideal for 3-D stacking.

T-4909: The 4909 is a low-cost, manual die bonder with an air bearings table and integrated fully programmable microprocessor. Equipped with True Vertical Technology and a 360° rotatable tool spindle, T-4909 is ideal for research and development. Because of the ease of use operation, the machine can be used for smaller production runs.

T-3002-M: The manual, high-precision die bonder T-3002-M features the company’s patented die ejector for wafer pickup up to 8" and is equipped with True Vertical Technology as well as a 360° rotating tool spindle. Due to the modular concept, this machine is compatible with most Tresky options. Additionally, t is ideal for small and medium production, and also features both ergonomic operability and high reliability.

T-3002-FC3: This manual die bonder is an all-purpose system with motorized Z-axis and True Vertical Technology. Because of the modular concept and numerous optional modules that easily can be adapted to the wide range of applications in microelectronics, it is particularly suited for development and smaller production runs. The die-bonder is available in two basic configurations: T-3000-FC3 without wafer table and T-3002-FC3 with die ejector for up to 8" wafers.

High-Force (HF) Module for FC3: The newly developed HF module for the FC3 series, which already has been successfully used by customers, expands the bond force range up to 50 kg. The ingenious system, in combination with True Vertical Technology, allows for no force to be applied to the frame structure while maintaining parallelism and accuracy.

Rework Head for FC3: The company also features an easily integrated hot-gas rework head for soldering and desoldering components into the FC3-series. The fine adjustment in X, Y and Theta also allows the use of the beam splitter module, and high accuracy can be achieved even for critical applications. The BGA rework head can be used simultaneously with the pick-and-place and dispenser unit, eliminating changeovers. The optional solder removal modules complement the range of applications.

T-6000: The fully automatic T-6000 offers automatic placement with the possibility of manual assembly without complex programming. The many existing options, such as the wafer table for up to 8" wafer, die flipper, stamp unit or the best heating systems for eutectic and thermo-compression applications, also are compatible with T-6000.

T-8000: T8000 is a result of Tresky’s continuous development. The built-in granite, equipped with linear motors and high-resolution direct measurement systems, means the machine is characterized by a large working area of 500 x 400 mm and up to 12" wafer table. A novel eutectic bonding head with integrated tilt adjustment allows automatic switching of heated tool tips without the influencing parallelism. The robust Z-axis, also with direct measuring system, can apply a maximum bonding force of 10 kg. Additionally, T-8000 is compatible with the many existing options, making it optimally adapted to a variety of applications.

For more information, please contact us or visit

For over 30 years, Tresky has been working to perfect the art of pick-and-place systems. Tresky supports many applications. From manual to automotive, adhesives to tools, Tresky has the extensive experience and modular setup to meet customers’ needs. With many devices installed across the world, and often with specialized and custom equipment, Tresky relies on its fast, flexible team of professionals to rise to the challenges of complex process requirements. For more information, visit the company at

You must be a registered user to talk back to us.

More News from Tresky AG

Oct 18, 2013 -

Tresky Holds Successful Showing at iMAPS 2013, Appoints 3 New Reps

Jun 25, 2013 -

Tresky Appoints NW Test Solutions Inc. as Its Newest Rep

Jun 20, 2013 -

Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics

Jun 20, 2013 -

Tresky to Display T-6000 Die Bonder at SEMICON West 2013

Tresky’s Product Technologies Provide High-Quality Solutions for Microelectronics news release has been viewed 799 times

PCB Assembly Equipment Auctions

Reflow Ovens thermal process improvement