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Tresky to Display T-6000 Die Bonder at SEMICON West 2013

Jun 20, 2013

Tresky, a worldwide leading manufacturer of micro-assembly and rework applications, announces that it will display the T-6000 Flexible Automatic Die Bonder in Booth #5770 at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013 at the Moscone Center in San Francisco, CA. Tresky will co-exhibit with XYZTEC.

The T-6000 Die Bonder is an all-purpose system for R&D, pilot and medium-size production.

Die handling is standard from wafer, waffle-pack and gel-pack. Automatic die assembly using pattern recognition is combined with ease of use operation and suited for manual single die placement.
The fully automatic T-6000 offers automatic placement with PRS with the possibility of the manual assembly, without complex programming. The many existing options — such as the wafer table for up to 8" wafer, die flipper, stamp unit and the best heating systems for eutectic and thermo-compression applications — also are compatible with the T-6000.

For more information, stop by Booth #5770 or visit www.tresky.com.


For over 30 years, Tresky has been working to perfect the art of pick and place systems.  Tresky supports many applications; from manual to automotive, adhesives to tools, Tresky has the extensive experience and modular setup to meet their customer’s needs.  With many devices installed across the world, and often with specialized and custom equipment, Tresky relies on their fast, flexible team of professionals to rise to the challenges of complex process requirements.

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