SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Viscom AG

Viscom SI Release 7.46 – more performance for Viscom 3-D SPI, AOI and AXI

Jun 18, 2013

3-D display of a solder paste defect with the Viscom  SPI 3-D Viewer.

3-D display of a solder paste defect with the Viscom SPI 3-D Viewer.

With the Software Release SI 7.46, the developers at Viscom have integrated many new functionalities that further increase the performance capability of its inspection systems. This reaches from cycle time reduction for typical component types through improvements in the global use of inspection libraries, up to innovations in the areas of 3-D SPI and X-ray inspection. All innovations involve the Viscom software SI.

The SI Release 7.46 provides customers with innovations that further boost the performance and convenience of both optical and X-ray inspection. Additionally, the new software version features numerous other improvements that relieve the operator and increase system performance.

For example, AOI inspection times can be further reduced with the 8M technology. This has been accomplished through improved optimization of the travel paths. This way, the same reliable inspection can be attained with fewer axis positions.

An additional highlight is the integration of the Library Manager. By using this software tool, new inspection patterns can be assigned even more quickly and easily. Therefore, the use of local and global inspection libraries is even more convenient. The new functionality can be used in parallel with the tried and tested library toolbox.

Another software advancement concerns the AOI Desktop system S2088-II and was initiated by a customer request. It enables the detailed appraisal of recognized defects in parallel with defect verification. In the review process, live images  of the defects can be displayed on the HARAN verification station. The camera head moves directly to the defect position  with a simple keypress. Thus, a live capture of the defect image can be viewed under different camera perspectives — orthogonal and angled — and in color.

Release 7.46 also brings further interesting developments in 3-D solder paste inspection. This inspection has proven itself in practice and due to Quality Uplink, enables convenient process optimization. With the new Release, the SPI Closed Loop (Downlink) has been completely integrated. With it, it is possible to return currently measured displacement values of the SPI inspection to the paste printer as offset correction values. Thus, an automatic correction of the print stencil can be carried out if the print image is displaced during production. Furthermore, there is an option to initiate automatic cleaning of the paste printer. EKRA, DEK and Speedline (MPM) interfaces already have been successfully implemented in field test; other interfaces can be integrated on request or already are in development.


You must be a registered user to talk back to us.

More News from Viscom AG

May 09, 2017 -

Viscom picks up two awards in Asia for its economical 3D AOI

May 08, 2017 -

Viscom Wins SMT China Vision Award for its Powerful 3D AOI Solution

Apr 03, 2017 -

Ultra-modern data exchange with the Viscom Open Interface 4.0

Mar 30, 2017 -

Optimal optical 3D solder joint measurement from Viscom

Mar 10, 2017 -

Save the date: Viscom Technology Forum starts June 21, 2017 in Hanover

Mar 08, 2017 -

Viscom Recognizes Matthews Associates for ‘Most 3D AOI System Sales’ in 2016

Feb 23, 2017 -

Networked 3D inspection from Viscom at DELTEC

Feb 23, 2017 -

Viscom Awards Horizon Sales for Outstanding Sales Performance

Feb 15, 2017 -

Viscom’s S3088 ultra gold wins the NPI Award for Test & Inspection – AOI

Feb 07, 2017 -

Mobile Process Monitoring with the New Viscom App

(83) more news from Viscom AG

Viscom SI Release 7.46 – more performance for Viscom 3-D SPI, AOI and AXI news release has been viewed 1122 times

Solder Paste Inspection