Engineered Material Systems, Inc., a leading global supplier of negative photoresist materials for MEMs and IC cooling applications, introduces NR-2500 Liquid Negative Photoresist for use in micro-electromechanical systems (MEMS). This material formulation has been optimized for spin coating and processing on MEMS and IC wafers.
The cured chemistry can withstand harsh environments including resistance to extreme moisture conditions and corrosive chemicals. The NR-2500 photoresist is tougher (less brittle) than other negative photoresists in the market with a glass transition temperature of 165°C (by DMA Tan Delta) and a moderate modulus of 4.5 GPa at 25°C. The cured chemistry is hydrophobic in nature providing for chemical and moisture resistance. The NR series is available in various solids/viscosities that can achieve from 2-40 μm thickness in a single layer.
NR-2500 photoresist is compatible with the EMS line of dry-film photoresists. NR-2500 liquid photoresist is the latest addition to the company’s full line of film and liquid negative photo resists formulated for making microfluidic channels and permanent features on MEMS devices and integrated circuits.
For more information about the new NR-2500 Liquid Negative Photoresist or to learn how Engineered Materials Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.
Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.