SMT, PCB Electronics Industry News

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News from KYZEN Corporation


Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components at SEMICON West

Jun 10, 2013

Kyzen will showcase AQUANOX® A4638 Advanced Packaging Cleaning Chemistry in Booth #5547 in the North Hall at the 2013 SEMICON West exhibition & conference, July 9-11, 2013 at the Moscone Center in San Francisco, CA.

Aquanox® A4638 removes flux residue from flip chip and low clearance components. A4638 rapidly removes water soluble polar flux residues and exhibits a low surface tension. Incorporating Kyzen’s inhibition technology, A4638 offers exceptional material compatibility and is a non-hazardous, biodegradable aqueous solution containing no CFCs or HAPs.

AQUANOX® A4638 is available in one, five and 55 gallon containers. In addition to AQUANOX® A4638, Kyzen offers a full line of precision cleaning chemistries that meet any cleaning challenge.

Kyzen® and AQUANOX® are registered trademarks in the United States and other countries.


Kyzen specializes in precision cleaning chemistries for electronics, advanced packaging, metal finishing and aerospace applications. Kyzen’s industry expertise and dedicated customer support provide integrated cleaning process solutions that meet any cleaning challenge. Founded in 1990, Kyzen is the leading provider of environmentally responsible, RoHS compliant cleaning chemistries to industries worldwide. For more information, please visit www.kyzen.com

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Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components at SEMICON West news release has been viewed 485 times

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