SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components at SEMICON West

Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components at SEMICON West

Jun 10, 2013

Kyzen will showcase AQUANOX® A4638 Advanced Packaging Cleaning Chemistry in Booth #5547 in the North Hall at the 2013 SEMICON West exhibition & conference, July 9-11, 2013 at the Moscone Center in San Francisco, CA.

Aquanox® A4638 removes flux residue from flip chip and low clearance components. A4638 rapidly removes water soluble polar flux residues and exhibits a low surface tension. Incorporating Kyzen’s inhibition technology, A4638 offers exceptional material compatibility and is a non-hazardous, biodegradable aqueous solution containing no CFCs or HAPs.

AQUANOX® A4638 is available in one, five and 55 gallon containers. In addition to AQUANOX® A4638, Kyzen offers a full line of precision cleaning chemistries that meet any cleaning challenge.

Kyzen® and AQUANOX® are registered trademarks in the United States and other countries.


Kyzen specializes in precision cleaning chemistries for electronics, advanced packaging, metal finishing and aerospace applications. Kyzen’s industry expertise and dedicated customer support provide integrated cleaning process solutions that meet any cleaning challenge. Founded in 1990, Kyzen is the leading provider of environmentally responsible, RoHS compliant cleaning chemistries to industries worldwide. For more information, please visit www.kyzen.com

Jul 17, 2017 -

KYZEN to Show First of Its Kind, Real-Time Concentration Monitoring & Reporting System at NEPCON South China

Jun 13, 2017 -

SEMICON West

May 31, 2017 -

KYZEN Expands EU Facilities to Meet Growing Demand

May 22, 2017 -

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR

May 21, 2017 -

Cleaning & Coating Conference in Amsterdam

May 18, 2017 -

KYZEN Exhibits at SMTA Toronto Expo / ICSR

Apr 26, 2017 -

KYZEN Awarded for New Industry 4.0 Enabled KYZEN ANALYST™ at NEPCON China

Apr 22, 2017 -

KYZEN’s Newest Innovation, the KYZEN ANALYSTTM, Will Be Launched at SMT Hybrid Packaging 2017 this May!

Apr 11, 2017 -

Conference, May 22-24, 2017 in Amsterdam

Feb 20, 2017 -

KYZEN Earns 10th Service Award for Superior Customer Service

413 more news from KYZEN Corporation »

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jul 19, 2017 -

COT Reduces Prices on SMT Nozzles & Consumables

Jul 19, 2017 -

Cogiscan Partners with iBASEt for Automated Electronics Assembly

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Jul 19, 2017 -

Logic PD Appoints Eric Wilkowske as Vice President of Products, Design & Engineering

Jul 18, 2017 -

ASSEMBLY-TECH LLC to Represent PDR Americas

See electronics manufacturing industry news »

Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components at SEMICON West news release has been viewed 537 times

  • SMTnet
  • »
  • Industry News
  • »
  • Learn About Kyzen’s Advanced Packaging Cleaning Chemistry for Flip Chip and Low Clearance Components at SEMICON West
PCB Cleaning

Six Sigma Training