Ideal for lead frame power semiconductor packages! Hesse Mechatronics to introduce and demo the new Bondjet BJ931L to attendees at SEMICON West
Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
The Bondjet BJ931L Fully Automatic Dual-Head Wedge Bonder enables simultaneous bonding of thin and heavy wire or ribbon for lead frame and matrix power semiconductor applications such as transistor outline (TO) packages and similar discrete devices with low pin counts.
The Bondjet BJ931L offers:
- Small 1650 mm x 1200 mm footprint
- Highest throughput on the market - up to 4500 UPH dependent upon application
- Flexibility - Interchangeable bond heads for heavy wire, thin wire, ribbon wire and copper wire
- Patented PiQC™ analyzes each bond in real time to ensure the quality of every device
- E-Box™ optical tool adjustment
“The Bondjet BJ931L enables the fastest throughput available today for power semiconductor packages, and we are pleased to have a machine that directly meets the specific needs of this growing market segment,” notes Joseph S. Bubel, president of Hesse Mechatronics, Inc. “We look forward to demonstrating the BJ931L to the international audience at SEMICON West.”
For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website www.hesse-mechatronics.com. For more information on Hesse Mechatronics’ training and applications support services, please e-mail firstname.lastname@example.org. To see wire bonding in action, visit www.wirebonddemo.com.
Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders, ribbon bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon); their heavy wire wedge bonder models also handle copper wire and ribbon. The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.