SMT, PCB Electronics Industry News

New Dual-Head Wedge Bonder Makes Americas Debut

Jun 07, 2013

The Bondjet BJ931L Fully Automatic Dual-Head Wedge Bonder enables simultaneous bonding of thin and heavy wire or ribbon for lead frame and matrix power semiconductor applications such as transistor outline (TO) packages and similar discrete devices with low pin counts.

The Bondjet BJ931L Fully Automatic Dual-Head Wedge Bonder enables simultaneous bonding of thin and heavy wire or ribbon for lead frame and matrix power semiconductor applications such as transistor outline (TO) packages and similar discrete devices with low pin counts.

Ideal for lead frame power semiconductor packages! Hesse Mechatronics to introduce and demo the new Bondjet BJ931L to attendees at SEMICON West

Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.

The Bondjet BJ931L Fully Automatic Dual-Head Wedge Bonder enables simultaneous bonding of thin and heavy wire or ribbon for lead frame and matrix power semiconductor applications such as transistor outline (TO) packages and similar discrete devices with low pin counts. 

The Bondjet BJ931L offers:

  • Small 1650 mm x 1200 mm footprint
  • Highest throughput on the market - up to 4500 UPH dependent upon application
  • Flexibility - Interchangeable bond heads for heavy wire, thin wire, ribbon wire and copper wire
  • Patented PiQC™ analyzes each bond in real time to ensure the quality of every device
  • E-Box™ optical tool adjustment

The Bondjet BJ931L enables the fastest throughput available today for power semiconductor packages, and we are pleased to have a machine that directly meets the specific needs of this growing market segment,” notes Joseph S. Bubel, president of Hesse Mechatronics, Inc. “We look forward to demonstrating the BJ931L to the international audience at SEMICON West.

For more information on Hesse Mechatronics and its family of wedge bonders, please visit the company’s website www.hesse-mechatronics.com.  For more information on Hesse Mechatronics’ training and applications support services, please e-mail info@hesse-mechatronics.us. To see wire bonding in action, visit www.wirebonddemo.com.


Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders, ribbon bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon); their heavy wire wedge bonder models also handle copper wire and ribbon. The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages.

Jan 24, 2014 -

Hesse Mechatronics Appoints Representative for South America

Oct 31, 2013 -

Hesse Mechatronics to Demonstrate Wedge Wire Bonding Capabilities at Productronica

May 06, 2013 -

Hesse Mechatronics Launches Heavy Wire and Ribbon Bonding Services for Early Stage Product Development

Apr 13, 2013 -

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Mar 06, 2013 -

Hesse & Knipps is now Hesse Mechatronics

Mar 06, 2013 -

Hesse & Knipps is now Hesse Mechatronics.

Sep 04, 2012 -

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Aug 14, 2012 -

Hesse & Knipps Appoints CWI Technical Sales as Rep for East Coast United States and Eastern Canada

Aug 02, 2012 -

Hesse & Knipps Appoints Prospect Technical Sales as Rep throughout Northwest United States and Canada

Jul 25, 2012 -

Hesse & Knipps, Inc. Appoints New Technical Training Manager

3 more news from Hesse Mechatronics »

May 25, 2018 -

Saelig Introduces LoRa/FSK Smart Modem Transceiver For Long Range Control

May 25, 2018 -

Allchips won 10 million of A Round Investment in January 2018

May 24, 2018 -

DOVER CORPORATION SELECTS OK INTERNATIONAL – CYPRESS AS AN INAUGURAL WINNER OF THE DOVER SAFETY EXCELLENCE AWARD

May 24, 2018 -

DOVER CORPORATION SELECTS OK INTERNATIONAL – CYPRESS AS AN INAUGURAL WINNER OF THE DOVER SAFETY EXCELLENCE AWARD

May 24, 2018 -

CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology at SEMICON West

May 23, 2018 -

Koh Young, the 3D Inspection Market Leader, Reports Strong Quarterly Results Again

May 22, 2018 -

Metcal Is Reinventing Hand Soldering – Learn More at the SMTA Upper Midwest Expo

May 22, 2018 -

Europlacer to Show Full Assembly Line Products & Solutions at SMT Nuremberg.

May 22, 2018 -

IPC Releases Additional Test Coupons for the IPC-2221B Gerber Coupon Generator Test Coupons provide structural integrity verification based on current printed board design technology

May 22, 2018 -

Specialized Coating Services Hosts Successful Open House for New Billerica Facility

See electronics manufacturing industry news »

New Dual-Head Wedge Bonder Makes Americas Debut news release has been viewed 1068 times

Facility Closure

Flying Probe Probe Tester with AOI