IPC — Association Connecting Electronics Industries® and the Surface Mount Technology Association announced today the finalized agreement to co-locate the SMTA International Conference and Exhibition (SMTA International) with the IPC Fall Standards Development Committee Meetings for 2013, 2014 and 2015.
SMTA President Bill Barthel commented, “I am pleased to welcome IPC standards activities to our International Technical Conference and Exhibition. We see the leading edge technology and the all-important standards development as a great combination for attendees.”
“We’re delighted to be able to offer SMTAI attendees the opportunity to participate in IPC standards development,” said IPC President & CEO John Mitchell. “In developing the key industry standards and guidelines for the printed board and electronics manufacturing industries around the world, IPC committees provide an important and valuable platform for companies to give input and help shape the future of the industry.”
The SMTA International Conference and Exhibition (SMTA International) will be held October 13–17, 2013 and the IPC Fall Standards Development Committee Meetings will be held October 12–17, 2013 at the Fort Worth Convention Center.
IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies and related business operations.