SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


IPC and CALCE Seek Technical Papers for Tin Whiskers Symposium

May 15, 2013

IPC – Association Connecting Electronics Industries® and the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland have issued a call for papers for the 7th International Symposium on Tin Whiskers. Sponsored by Lockheed Martin, the symposium will take place November 12–13, 2013, in Costa Mesa, Calif.

Expert presentations are sought on the full range of tin whiskers theory and practice in every market sector, including military/aerospace, aviation, medical, automotive, telecom and consumer. The content of the presentations should be noncommercial in nature and cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies.

Those interested in presenting have until July 1 to submit an abstract of 250 to 300 words summarizing technical work that has not been previously published, a professional biography and complete contact information to Dr. Michael Osterman, CALCE operations director, at Osterman@calce.umd.edu. Authors will be notified of status by July 29, and will have a deadline of October 11 to provide completed papers and full presentation slides.

More information about the conference and submission requirements is available at www.ipc.org/tin-whiskers-2013-cfp.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.


The Center for Advanced Life Cycle Engineering (CALCE www.calce.umd.edu), the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

Feb 16, 2017 -

Long-time IPC Volunteer, Doug Pauls Inducted into IPC Hall of Fame

Feb 16, 2017 -

IPC Elects New Board Member

Feb 07, 2017 -

Best Technical Paper at IPC APEX EXPO 2017 Selected

Feb 06, 2017 -

Pana-Pacific Earns IPC/WHMA-A-620 Qualified Manufacturers Listing

Feb 03, 2017 -

IPC Invites Member-Company Executives to Help Build “Pulse-of-the-Industry” Data Service

Feb 02, 2017 -

North American PCB Sales Enjoyed Solid Growth in December

Jan 29, 2017 -

IPC President and CEO John Mitchell to Serve on the NAM’s Council of Manufacturing Associations Board of Directors

Jan 21, 2017 -

IPC North American EMS and PCB Statistical Programs Open

Jan 17, 2017 -

Colonial Assembly and Design, LLC Earns IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing

Dec 27, 2016 -

Newly Elected Congressman Discusses U.S. Policy Priorities with Bay Area Manufacturers

(802) more news from Association Connecting Electronics Industries (IPC)

IPC and CALCE Seek Technical Papers for Tin Whiskers Symposium news release has been viewed 376 times

Large PCB Dispensing System

soldering station