SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


IPC and CALCE Seek Technical Papers for Tin Whiskers Symposium

May 15, 2013

IPC – Association Connecting Electronics Industries® and the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland have issued a call for papers for the 7th International Symposium on Tin Whiskers. Sponsored by Lockheed Martin, the symposium will take place November 12–13, 2013, in Costa Mesa, Calif.

Expert presentations are sought on the full range of tin whiskers theory and practice in every market sector, including military/aerospace, aviation, medical, automotive, telecom and consumer. The content of the presentations should be noncommercial in nature and cover case histories, theories of tin whisker growth, experiments and results, risk evaluation methods and risk mitigation strategies.

Those interested in presenting have until July 1 to submit an abstract of 250 to 300 words summarizing technical work that has not been previously published, a professional biography and complete contact information to Dr. Michael Osterman, CALCE operations director, at Osterman@calce.umd.edu. Authors will be notified of status by July 29, and will have a deadline of October 11 to provide completed papers and full presentation slides.

More information about the conference and submission requirements is available at www.ipc.org/tin-whiskers-2013-cfp.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.


The Center for Advanced Life Cycle Engineering (CALCE www.calce.umd.edu), the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

Apr 22, 2017 -

Congresswoman Discusses U.S. Policy Priorities with IPC Member-company, TTM Technologies

Apr 13, 2017 -

Congressman Discusses U.S. Policy Priorities with Staff at IPC Member-company, VirTex

Apr 11, 2017 -

SEC Suspends Enforcement of Conflict Minerals Rule, Cites IPC Comments Statement from John Mitchell, IPC President and CEO

Apr 11, 2017 -

IPC Membership in Europe Grows to More than 600 Company Sites Brussels office provides full suite of IPC products and services

Apr 04, 2017 -

IPC Supports EU Council Formal Approval of Voluntary Conflict Minerals Requirements for Manufacturers

Mar 31, 2017 -

IPC Announces Growing Industry Support for the Connected Factory Exchange (CFX) Initiative

Mar 31, 2017 -

North American PCB Order Growth Boosts Book-to-Bill Ratio

Mar 27, 2017 -

IPC Membership Reaches Significant Milestone IPC membership is now more than 4,000 member-sites strong

Mar 23, 2017 -

IPC Announces Honorees of Government IMPACT Award

Mar 14, 2017 -

IPC Global Marketplace Delivers Intelligent Search Technology

(821) more news from Association Connecting Electronics Industries (IPC)

IPC and CALCE Seek Technical Papers for Tin Whiskers Symposium news release has been viewed 399 times

Capillary Underfill process

Used PCBA Equipment