SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • MPM® EnclosedFlow™ Delivers Superior Fine Feature Printing, Major Paste Savings over Squeegee Blades

MPM® EnclosedFlow™ Delivers Superior Fine Feature Printing, Major Paste Savings over Squeegee Blades

May 11, 2013

The MPM® EnclosedFlow™ print head by Speedline Technologies is a revolutionary enclosed media printing technology that offers significant process and cost advantages over printing with metal squeegee blades

The MPM® EnclosedFlow™ print head by Speedline Technologies is a revolutionary enclosed media printing technology that offers significant process and cost advantages over printing with metal squeegee blades

The MPM® EnclosedFlow™ print head by Speedline Technologies is a revolutionary enclosed media printing technology that offers significant process and cost advantages over printing with metal squeegee blades. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.

EnclosedFlow features an all new positive-displacement, motor-driven pressure system that controls paste chamber pressures to within +/- 0.1 psi, setting a new standard for tight process control, and delivering superior volume/yield on fine pitch pads. Print fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than squeegee blades. EnclosedFlow is also superb for high-volume fills such as paste-in-hole, where complete barrel filling is desired.

EnclosedFlow is MPM’s ‘plug-and-print’ solution, because it’s easy to set up and operate, providing superior results from the first print. It recovers instantly from production pauses, and generates paste savings in many cases in excess of 50% for a fast payback. With fewer parts, EnclosedFlow is quicker and easier to clean, with less paste waste, and changeover to a different head or from a blade setup is accomplished in only a few minutes.

EnclosedFlow is perfect for high product mix environments, since its easily detachable, modular chambers (different paste types, Pb-free, Sn/Pb) can be removed and safely stored with less than 5 minutes needed for changeover. No need to throw away paste at the end of a shift; save 100s of grams of paste each day by simply removing and storing the print head for the next time it’s needed. EnclosedFlow also uses industry-standard cartridges.

EnclosedFlow is available for the MPM Momentum series, Accela, and new printers; supported sizes include 8”, 10”, 12”, 14”, 16” 18” (203mm, 254mm, 305mm, 356mm, 406mm, 457mm).


Speedline Technologies is the global leader in process knowledge, services and manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries.  Based in Franklin, Massachusetts, USA, the company markets five best-in-class brands:  Accel microelectronics cleaning equipment; Camalot dispensing systems; Electrovert wave soldering, reflow soldering and cleaning equipment; MPM stencil and screen printing systems; and Protect global services, support and training solutions. For more information about Speedline Technologies visit www.speedlinetech.com

Jan 29, 2017 -

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Jan 25, 2017 -

ITW EAE Introduces MPM 100 Printer to Meet Market Demand for Reduced Cost

Mar 31, 2016 -

Speedline MPM Edison Printer Takes an Impressive New Product Introduction Award at APEX 2016

Feb 24, 2016 -

Speedline Displays New Technologies at APEX 2016, MPM, Electrovert, and Camalot Products

Nov 18, 2015 -

Speedline Technologies’ MPM Edison Printer Takes Prestigious Global Technology Award at Productronica 2015

Oct 27, 2015 -

Speedline Launches MPM® Edison Next Generation Printer Platform

Aug 22, 2014 -

Speedline's Isaiah Smith to Present at SMTAI 2014; PCB Assembly Solutions also to be Exhibited.

Aug 06, 2014 -

Free PCB Cleaning and Reliability Workshop Planned Sept. 9 in Guadalajara

Jun 12, 2014 -

Speedline Launches New Electrovert® Electra™ Next Generation Wave Soldering System

Apr 30, 2014 -

Speedline Launches Space-Saving MPM® Momentum® BTB (Back to Back) Printers for Dual Lane Configuration

8 more news from Speedline Technologies, Inc. »

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

See electronics manufacturing industry news »

MPM® EnclosedFlow™ Delivers Superior Fine Feature Printing, Major Paste Savings over Squeegee Blades news release has been viewed 1721 times

  • SMTnet
  • »
  • Industry News
  • »
  • MPM® EnclosedFlow™ Delivers Superior Fine Feature Printing, Major Paste Savings over Squeegee Blades
PCB machines

Panasonic OEM Solutions