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Engineered Material Systems to Debut Low-Cost Conductive Adhesive for Back Contact Solar Modules at SNEC 2013

Apr 25, 2013

 Engineered Material Systems will debut its new DB-1588-2 Low-Cost Conductive Adhesive for back contact applications in crystalline silicon solar modules in booth #W3-688 at the 2013 SNEC 7th International Photovoltaic Power Generation Conference & Exhibition, scheduled to take place May 14-16, 2013 at the Shanghai New International Expo Center in China.

DB-1588-2 is designed to make contact from vias or other conductors on the solar cells to the back contact sheet. The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to back contact metallizations during damp heat exposure. Additionally, the conductive adhesive is designed to cure through the encapsulant lamination and cure process. This material is approximately 50 percent lower cost than standard silver-filled adhesives and is significantly lower cost than the EMS DB-1588-1 product currently used for manufacturing back contact solar modules.

The DB-1588-2 conductive adhesive is the latest addition to Engineered Conductive Materials’ full line of conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications as well as conductive grid inks for photovoltaic applications.

For more information about the DB-1588-2 Low-Cost Conductive Adhesive or to learn how Engineered Material Systems can define, develop and create an engineered material solution that is right for your company, visit www.emsadhesives.com.


Engineered Materials Systems, Inc. (EMS) technology focus is on electronic materials for semiconductor, circuit assembly, photovoltaic, printer head, camera module, disk drive and photonics assembly product lines. The company creates continual improvements that will guide its customers into the future. For more information, visit www.emsadhesives.com.

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