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MIRTEC RECEIVES 18th INDUSTRY AWARD AT NEPCON SHANGHAI

Apr 25, 2013

 MIRTEC, “The Global Leader in Inspection Technology”, announces that it has been awarded a 2013 EM Asia Innovation Award in the category of Test & Measurement/Inspection Systems – AOI for its MV-9 2D/3D CoaXPress In-Line AOI Series. The award was presented to the company during an April 24, 2013 ceremony in Shanghai during NEPCON China. This marks MIRTEC’s 18th industry award.

"We are extremely proud to receive the 2013 EM Asia Innovation Award on behalf of MIRTEC’s extremely talented engineering team for their outstanding performance in the design and development of our new MV-9 2D/3D CoaXPress In-Line AOI Series. Having received a total of four (4) consecutive industry awards thus far, the MIRTEC MV-9 2D/3D AOI Series is arguably the most highly honoured inspection system in the world!,” stated Brian D’Amico, President of MIRTEC Corp.

MIRTEC’s all new MV-9 2D/3D CoaXPress In-Line AOI systems are configured with MIRTEC’s revolutionary OMNI-VISION® 3D Inspection Technology that combines 25 Mega Pixel 2D Inspection with advanced Digital Multi-Frequency Moiré 3D inspection to provide precision inspection of SMT devices on finished PCB assemblies.  The MV-9 systems may be configured with a state-of-the-art CoaXPress 25 Mega Pixel top-down camera system.  This proprietary camera system is designed and manufactured by MIRTEC for use with the company’s complete product range of inspection equipment.

MIRTEC’s revolutionary CoaXPress Camera Technology is capable of providing data transfer rates of 25 Gbit/Second making the MV-9 the fastest 2D/3D AOI system in the world! MIRTEC’s technologically advanced Six Phase Lighting System uses multi-color LEDs to illuminate inspection areas from six different angles providing superior solder joint characterization and co-planarity inspection of leads on gull-wing devices.  MIRTEC’s revolutionary Digital Multi Frequency Quad Moiré Technology provides true 3D inspection of SMT devices on finished PCB assemblies using a total of four (4) Moiré Inspection Probes.  This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.

Established in 2006, the EM Asia Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward.


MIRTEC is a leading global supplier of automated inspection systems to the electronics manufacturing industry.  For further information, please visit www.mirtec.com.

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