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News from Hesse Mechatronics

Hesse Mechatronics, Inc. Appoints Senior Business Development Manager

Apr 13, 2013

Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, has appointed Michael McKeown as Senior Business Development Manager.

Michael will be in charge of strengthening Hesse Mechatronics’ position in the power electronics market. His broad knowledge and technical experiences will inform clients to the power and technical superiority of the 935, 939 and 931L fully automatic heavy wire bonders. Michael will also focus on promoting thin wire bonder sales.

Michael carries almost three decades of experience in the automotive and power electronics industry. Before joining Hesse Mechatronics, Michael oversaw sales territories in U.S. and Canada at Materion Technical Materials, where he managed market research and was involved with aluminum clad copper inlay for wire bondable leadframes. Prior to Materion, Michael was the Eastern Regional Sales Manager for Orthodyne Electronics, which manufactures ultrasonic wire bonders for the semiconductor and microelectronic industries.

His extensive knowledge of customers’ heavy wire applications and process challenges will be a perfect fit for the needs of our customer base and the capabilities of our heavy wire product line,” noted Joseph S. Bubel, President of Hesse Mechatronics, Inc.

Michael is the author of more than a dozen technical papers and journal articles. He is currently working towards his Ph.D. at Leeds Metropolitan University.

Hesse Mechatronics, a privately held worldwide company based in Paderborn, Germany, is a leading designer and manufacturer of high speed fine pitch wedge bonders, heavy wire bonders and complementary equipment for semiconductor backend assembly. The company’s automatic wedge bonders handle both light and heavy wire applications with aluminum and gold round wire from 12.5 micron (.0005) to 500 microns (.020) in diameter, in addition to ribbon wire from 6 x 35 microns up to .3 x 2 mm, including HCR™ (High Current Ribbon); their heavy wire wedge bonder models also handle copper wire and ribbon. The company’s product line also includes dispensers, ultrasonic flip chip bonders, standard or customized indexers with or without handling systems, manufacturing process monitoring systems for interfacing with the company’s equipment and commercial software packages. For more information, please visit the company’s website at

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