IPC Issues Call for Participation for 2014 IPC APEX EXPO

Apr 03, 2013

 IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas. The technical conference will be held March 25-27, 2014, and the professional development courses will be held March 23, 24 and 27, 2014.

The world’s premier conference and exhibition for the electronic interconnect industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. To recognize exceptional achievement, awards will be presented for “Best U.S. Paper” for U.S. authors and “Best International Paper” for authors outside the United States.

Expert presentations are being sought on design, materials, assembly, processes and equipment in the following areas:
Adhesives
Advanced Technology
Area Array/Flip Chip/0201
Assembly and Rework Processes
BGA Packaging
Black Pad and other Board Related Issues
Business & Supply Chain Issues
BTC/QFN/MLF
Conformal coatings
Counterfeit Electronics
Design
Electromigration
Electronics Manufacturing Services
Embedded Passive & Active Devices

Environmental Compliance
Flexible Circuitry
Head-in-Pillow, Component & Board Warpage
Lean Six Sigma
HDI Technologies
High Speed, High Frequency & Signal
      Integrity
Lead Free Fabrication, Assembly & Reliability
Microminiaturization
Nanotechnology
Optoelectronics
Packaging & Components
PoP


PCB Fabrication
PCB and Component Storage & Handling
Performance, Quality & Reliability
Photovoltaics
Printed Electronics
RFID Circuitry
Soldering
Surface Finishes
Test, Inspection & AOI
Tin Whiskers
Underfills
Via Plugging & Other Protection
2.5D/3D Packaging

A 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments, emphasize new techniques, discuss trends of interest and contain technical and/or appropriate test results. In addition, course proposals are solicited from individuals interested in presenting half-day professional development courses on design, manufacturing processes and materials. Reimbursement for travel expenses and an honorarium are offered to course instructors.

Both the technical conference paper abstracts and course proposals are due May 4, 2013. To submit an abstract or proposal, visit www.IPCAPEXEXPO.org/CFP.

For more information about conference presentations, contact Jasbir Bath, IPC conference director, at JasbirBath@ipc.org or Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.
For more information about half-day professional development courses, contact Susan Filz, IPC director of industry programs and professional development, at SusanFilz@ipc.org.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

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