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  • Embedded Component Technology Takes Center Stage at IPC/FED Conference Registration is now open

Embedded Component Technology Takes Center Stage at IPC/FED Conference Registration is now open

Mar 29, 2013

IPC – Association Connecting Electronics Industries® has opened registration for the IPC/FED Conference on Embedded Components, a forum for designers, manufacturers, suppliers and end-users of embedded component technologies to discuss the latest technological advancements. The conference will be held June 4-5 in Frankfurt, Germany, providing access to industry experts who are advancing embedded component technology, from OEMs to fabricators to assemblers to designers.

The IPC/FED Conference on Embedded Components is an excellent opportunity for every industry professional to get the latest information on reliability, test and assembly issues, as well as new manufacturing methods,” said Sanjay Huprikar, IPC vice president, member success. “The conference is designed to maximize knowledge and networking for attendees who have an interest in the embedded component technology industry.”

Conference session topics include an overview of embedded component technology in the present and in the future; the progress of embedded optical waveguides in PCBs; design and assembly process implementation for embedding passive and active components; embedding of passive and active components in a rigid-flex PCB; embedded ultra-thin chip packaging technology; and more.

Presenters include industry leaders such as Jϋrgen Wolf, Wϋrth Elektronik; Happy Holden, Gentex; Andreas Osterman, Fraunhofer, IZM; Christian Rössle, Schweitzer Electronik AG; Sjef van Gastel and Patrick Huberts, Assembléon; Ralf Brϋning, Zuken; Vern Solberg, Invensas; Michael Matthes, Wittenstein Electronics GmbH; Mike Morianz, Österreich; Henry Potts, Mentor Graphics; Paul Wang, MiTac; Jan Vanfletern, IMEC; and Hemet Shah, Cadence Design Systems.
Most presentations will be in English; however, English-German translation service is included in the cost of registration for all attendees. Information on the IPC/FED Conference on Embedded Components is available at www.ipc.org/embedded-conference.

Questions can be directed to Susan Filz, IPC director of industry programs, at SusanFilz@ipc.org or +1 847-597-2884.
In addition to the technical conference, a tabletop exhibition will showcase leading industry suppliers who will be available to answer attendees’ questions on the latest developments in embedded components technology. For more information about the exhibition, contact Maria Labriola, IPC sales manager, at MariaLabriola@ipc.org or +1 847-597-2886.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

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Embedded Component Technology Takes Center Stage at IPC/FED Conference Registration is now open news release has been viewed 635 times

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