SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Association Connecting Electronics Industries (IPC)


Senior VP of Amkor Technology to Deliver IPC ESTC Keynote on Achieving Exceptional Package Design

Mar 19, 2013

 Over the last few years, rival packaging technologies system-on-chip (SoC) and system-in-package (SiP) have converged, leading to the evolution of micro-EMS, a module level packaging that integrates the functional aspects of both SiP and SoC. Presenting the common applications and uses of these packaging types, Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.

In addition to covering the benefits and limitations of packaging types for major market segments, Dr. Lee will discuss simulation and modeling tools that are providing developers with unique insights to shorten overall development times. Moreover, he will divulge how Amkor’s holistic approach — looking at the totality of a product’s life cycle, from initial design through manufacturing and tests — is addressing challenges throughout system development.

IPC ESTC will also offer seven additional keynote presentations featuring leading industry experts from Cadence Design Systems, Intel Corporation, Lenovo, Medtronic, Microsoft, Multitest Elektronische Systeme GmbH and STATS ChipPAC, who will provide valuable insights into all arenas of system technologies.

More information on IPC ESTC is available at www.ipc.org/ESTC. For registration options, visit www.ipc.org/ESTC-register. Access to the exhibit hall is free to pre-registrants, a savings of $25 on-site. Individuals who register by April 26 can save $100 on a technical conference registration.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

You must be a registered user to talk back to us.

More News from Association Connecting Electronics Industries (IPC)

Nov 30, 2016 -

North American PCB Book-to-Bill Ratio Climbs to 1.08

Nov 17, 2016 -

PCB Executive Forum Focuses on Critical Issues Senior-level executives to meet at IPC APEX EXPO

Nov 15, 2016 -

Turn Inspiration into Innovation through IPC APEX EXPO 2017 Educational Programs

Nov 09, 2016 -

IPC Releases New Online Training Course, IPC Essentials

Nov 09, 2016 -

IPC Issues Statement on the 2016 Election Results

Nov 07, 2016 -

ISC Engineering, LLC Earns Certification as Qualified Manufacturer to IPC/WHMA-A-620

Oct 20, 2016 -

Session 4 of IPC & SMTA's Conference to Focus on Ultra-Thin or Nanocoatings

Oct 20, 2016 -

World PCB Production in 2015 Estimated at $58.6 Billion IPC World PCB Production Report Released

Oct 20, 2016 -

Mayim Bialik Chosen as Opening Keynote at IPC APEX EXPO 2017 Industry votes to hear from actress and neuroscientist

Oct 16, 2016 -

IPC Announces New ESD Control Certification Courses on IPC EDGE

(788) more news from Association Connecting Electronics Industries (IPC)

Senior VP of Amkor Technology to Deliver IPC ESTC Keynote on Achieving Exceptional Package Design news release has been viewed 491 times

PCB X-Ray Inspection

SMT in-printer dispensing