SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Senior VP of Amkor Technology to Deliver IPC ESTC Keynote on Achieving Exceptional Package Design

Senior VP of Amkor Technology to Deliver IPC ESTC Keynote on Achieving Exceptional Package Design

Mar 19, 2013

 Over the last few years, rival packaging technologies system-on-chip (SoC) and system-in-package (SiP) have converged, leading to the evolution of micro-EMS, a module level packaging that integrates the functional aspects of both SiP and SoC. Presenting the common applications and uses of these packaging types, Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.

In addition to covering the benefits and limitations of packaging types for major market segments, Dr. Lee will discuss simulation and modeling tools that are providing developers with unique insights to shorten overall development times. Moreover, he will divulge how Amkor’s holistic approach — looking at the totality of a product’s life cycle, from initial design through manufacturing and tests — is addressing challenges throughout system development.

IPC ESTC will also offer seven additional keynote presentations featuring leading industry experts from Cadence Design Systems, Intel Corporation, Lenovo, Medtronic, Microsoft, Multitest Elektronische Systeme GmbH and STATS ChipPAC, who will provide valuable insights into all arenas of system technologies.

More information on IPC ESTC is available at www.ipc.org/ESTC. For registration options, visit www.ipc.org/ESTC-register. Access to the exhibit hall is free to pre-registrants, a savings of $25 on-site. Individuals who register by April 26 can save $100 on a technical conference registration.


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.

Jul 23, 2017 -

Senator Ron Johnson Discusses U.S. Policy Priorities in Townhall Discussion with IPC-member Company, VirTex MTI

Jul 17, 2017 -

IPC Extends Deadline on Call for Participation for IPC APEX EXPO 2018 Deadline for technical conference paper abstracts extended to: July 21, 2017

Jul 16, 2017 -

IPC Invites Industry Members to Participate on IPC European Standards Steering Committee

Jul 05, 2017 -

North American PCB Business Weakens but Book-to-Bill Ratio Remains Positive

Jun 29, 2017 -

IPC Invites Industry Leaders to Participate in New Global Data Service Pulse of the Electronics Industry to provide insight on health of industry

Jun 20, 2017 -

Zentech Manufacturing, Inc. First to Recertify for IPC Qualified Manufacturers Listing

Jun 14, 2017 -

IPC Submits Comments to Trump Administration Regarding Modernization of NAFTA

Jun 07, 2017 -

IPC Hand Soldering Competition Winner Crowned at SMT Hybrid Packaging 2017

Jun 01, 2017 -

North American PCB Order Growth Pushes Book-to-Bill Ratio Higher

May 16, 2017 -

IPC Report Details How PCB Manufacturers Meet Current and Future Technology Demands

837 more news from Association Connecting Electronics Industries (IPC) »

Jul 23, 2017 -

PDR Americas Partners with Orr Marketing, Inc. in the Carolinas

Jul 23, 2017 -

Zuken Announces XJTAG DFT Assistant for CR-8000 PCB design suite

Jul 23, 2017 -

SMTA Welcomes New Board Members

Jul 23, 2017 -

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

See electronics manufacturing industry news »

Senior VP of Amkor Technology to Deliver IPC ESTC Keynote on Achieving Exceptional Package Design news release has been viewed 635 times

  • SMTnet
  • »
  • Industry News
  • »
  • Senior VP of Amkor Technology to Deliver IPC ESTC Keynote on Achieving Exceptional Package Design
Fully automatic selective soldering stations

pcb components vacuum pick up