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Kyzen to Unveil Concentrated Aqueous Stencil Cleaner at SMT/Hybrid/Packaging

Mar 18, 2013

 Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, will exhibit its new AQUANOX® A8820 Advanced Aqueous Stencil Cleaner in Booth # 7-523 at the SMT/Hybrid/Packaging 2013 exhibition and conference, April 16-18, 2013, at the Messezentrum in Nuremberg, Germany.

AQUANOX® A8820 is an engineered cleaning fluid designed to remove wet solder paste and uncured chip bonder adhesive from stencils used in surface mount printing processes. A8820 effectively removes common solder pastes and fluxes and demonstrates a favorable compatibility profile with stencil cleaning systems. Additionally, the no-foaming property of A8820 is compatible with all materials commonly used in electronic assembly manufacturing and cleaning processes.

AQUANOX® A8820 is available in one, five, and 55 gallon containers.

Kyzen® and AQUANOX® are registered trademarks in the United States and other countries.


Kyzen specializes in precision cleaning chemistries for electronics, advanced packaging, metal finishing and aerospace applications. Kyzen’s industry expertise and dedicated customer support provide integrated cleaning process solutions that meet any cleaning challenge. Founded in 1990, Kyzen is the leading provider of environmentally responsible, RoHS compliant cleaning chemistries to industries worldwide. For more information, please visit www.kyzen.com.

 

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