SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • SEHO to Showcase Innovative Developments at SMT/Hybrid/Packaging 2013 in Nuremberg

SEHO to Showcase Innovative Developments at SMT/Hybrid/Packaging 2013 in Nuremberg

Mar 18, 2013

SEHO Systems GmbH, one of the worldwide leading manufacturers of automated soldering systems and customer-specific solutions, will highlight several machines in hall 9, stand 209 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

The PowerSelective, designed for flexible miniwave processes and dip soldering processes, offers considerably greater flexibility and process reliability in selective soldering. This particularly applies to the batch model that is perfectly suited for lean production solutions and which may be easily adapted to any production environment.  Ergonomically designed work places with individual height adjustment for loading and unloading, inspection places, or assembly areas for additional processing of assemblies flexibly enhance this soldering system.

The PowerSelective features many innovative functions such as fiducial recognition with automatic alignment of assemblies, real quantity control for drop jet fluxer which controls the actual applied quantity of flux at each solder joint, warpage compensation which measures distortions caused by bended PCBs and automatically corrects the z height, or the very comfortable offline teach program VIP (Visual Intelligent Programming).

Definitively unique, this is an automated optical inspection system (AOI) that can be embedded directly in the selective soldering process. The system is used for the detection of soldering defects such as non-wetting or insufficient wetting, missing pin or bridging. The inspection begins immediately after the soldering process when the printed circuit board is fixed in the gripper of the soldering machine.  The AOI system can be easily integrated into a SEHO PowerSelective, offering remarkable cost savings in relation to floor space and board handling equipment.

In the field of wave soldering, SEHO will introduce two new and innovative modules.  Special applications such as wave soldering with masks require selective flux application which ensures that only the points to be soldered will be wetted, not the entire mask. This avoids creepage of flux underneath the mask. Simultaneously, flux consumption will be reduced remarkably and the required cleaning cycles for the mask will be decreased.  For these applications SEHO developed a coordinate fluxing unit that precisely applies the flux at the previously programmed points only. Other areas on the assembly will not be wetted.

Another module that will be installed behind the wave soldering machine accommodates an AOI system. This unit inspects the processed assemblies regarding typical THT soldering faults, missing or wrongly positioned components. This ensures early trend information about the production process quality under reproducible test conditions. The data gained by this automatic inspection contribute to process optimization and therefore increase the production quality.

In the field of reflow soldering, SEHO introduces the new PowerReflow II. Providing a heated length of 2700mm, this system is designed for medium-sized to large production volumes. Nine heating zones and an active cooling area of 900mm ensure flexible temperature profiling and perfect soldering results. For minimum maintenance requirements the system is equipped with a process gas cleaning unit. With a modern control unit and easy to program software, interfaces for integration into a fully automated production line and many other features, the PowerReflow II offers the finest soldering technology in its class and an ideal price-performance-ratio.

For more information visit SEHO at SMT/Hybrid/Packaging, hall 9, stand 209, or online at www.seho.de.

 


 

Apr 15, 2018 -

SEHO to Demo Modular Selective Solder System at S.E.E. Stockholm

Apr 10, 2018 -

Entry-Level Selective Soldering System with High-End Technology from SEHO at ElectronTechExpo

Mar 21, 2018 -

SEHO and Toratec to Demo Selective Solder System at NEPCON China

Feb 12, 2018 -

Heike Schlessmann Will Discuss Zero-Fault Production in Soldering Processes at APEX

Jan 28, 2018 -

Flexible, High-Volume Selective Soldering from SEHO at APEX

Nov 15, 2017 -

SEHO Receives Award for Integrating Additional Processes in Its Selective Soldering Systems

Oct 16, 2017 -

Intelligently Linked: Approaching the Smart Factory with Communicating Machines

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 15, 2017 -

Entry-Level Selective Soldering System with High-End Technology from SEHO at productronica India

Aug 14, 2017 -

SEHO to Showcase Complete Solutions at SMTAI

112 more news from SEHO Systems GmbH »

Apr 25, 2018 -

KYZEN Wins EM Asia Innovation Award for ANALYST Data Services Platform

Apr 25, 2018 -

PDR Enters Reps Agreement with Restronics

Apr 25, 2018 -

PACE Worldwide Appoints Neil Manson as European Regional Sales Manager

Apr 25, 2018 -

Dr. Mike Bixenman to Present at the SMTA Medical Electronics Symposium

Apr 25, 2018 -

ZESTRON Taiwan Inauguration

Apr 25, 2018 -

SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability at SEMICON Southeast Asia

Apr 25, 2018 -

Press preview for Seica SpA participation at SMT, Nuremberg, June 5-7 – 17 2018, Hall 5, Booth 220, Exhibition center, Nuremberg.

Apr 25, 2018 -

Metcal Receives 2018 SMT China Vision Award

Apr 25, 2018 -

Techcon Releases TSR2000 Series Smart Dispensing Robots

Apr 25, 2018 -

Koh Young Technology to highlight Next-generation Premium 3D AOI at NEPCON China 2018

See electronics manufacturing industry news »

SEHO to Showcase Innovative Developments at SMT/Hybrid/Packaging 2013 in Nuremberg news release has been viewed 1299 times

  • SMTnet
  • »
  • Industry News
  • »
  • SEHO to Showcase Innovative Developments at SMT/Hybrid/Packaging 2013 in Nuremberg
Capillary Underfill process

ADJUST-A-VAC Vacuum Tweezer for fragile components, wafers, MEMS devices tweezers