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  • Balver Zinn Singapore to Sponsor IPC Hand Soldering Competition in Conjunction with NEPCON Korea 2013

Balver Zinn Singapore to Sponsor IPC Hand Soldering Competition in Conjunction with NEPCON Korea 2013

Mar 12, 2013

 The Balver Zinn Group announces that Balver Zinn Singapore will sponsor and contribute SN100C solder wire to the IPC Hand Soldering Competition at NEPCON Korea 2013. Scheduled to take place from April 3-5 in COEX, Seoul, the competition will determine Korea’s “best of the best.”

During this three-day competition, participants will compete to build a functional electronics assembly in 30 minutes. Assemblies will be judged on soldering in accordance with IPC-A-610E Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. IPC-A-610 Master Instructors will serve as the judges.

Competitors will receive a professional mini-magnifier and cash prizes will be awarded to the top three finalists. Additionally, the winner of the division will move on to the IPC Hand Soldering World Championship 2014 to compete with craftsmen from all over the world.

Because the number of participants is limited, participation is on a first-come, first-served basis. Visit www.koss.kr for more information and to enter the competition.

The IPC Hand Soldering Competition is co-organized by IPC — Association Connecting Electronics Industries, K-Fairs Ltd. and Korea Electronics Technology Association (KETA).

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