SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Balver Zinn Singapore to Sponsor IPC Hand Soldering Competition in Conjunction with NEPCON Korea 2013

Balver Zinn Singapore to Sponsor IPC Hand Soldering Competition in Conjunction with NEPCON Korea 2013

Mar 12, 2013

 The Balver Zinn Group announces that Balver Zinn Singapore will sponsor and contribute SN100C solder wire to the IPC Hand Soldering Competition at NEPCON Korea 2013. Scheduled to take place from April 3-5 in COEX, Seoul, the competition will determine Korea’s “best of the best.”

During this three-day competition, participants will compete to build a functional electronics assembly in 30 minutes. Assemblies will be judged on soldering in accordance with IPC-A-610E Class 3 criteria, the speed at which the assembly was produced and overall electrical functionality of the assembly. IPC-A-610 Master Instructors will serve as the judges.

Competitors will receive a professional mini-magnifier and cash prizes will be awarded to the top three finalists. Additionally, the winner of the division will move on to the IPC Hand Soldering World Championship 2014 to compete with craftsmen from all over the world.

Because the number of participants is limited, participation is on a first-come, first-served basis. Visit www.koss.kr for more information and to enter the competition.

The IPC Hand Soldering Competition is co-organized by IPC — Association Connecting Electronics Industries, K-Fairs Ltd. and Korea Electronics Technology Association (KETA).

Jun 08, 2017 -

Balver Zinn Group and LLE Soluciones Quirmicas Appoints Repstronics as Exclusive Representative in Mexico

May 09, 2017 -

The Balver Zinn Group to Supply BRILLIANT B2012 Solder Wire for the SMT IPC Hand Soldering Competition

May 01, 2017 -

Balver Zinn Group at SMT Hybrid Packaging 2017

Feb 06, 2017 -

Henk Mathijssen Joins the Balver Zinn Group as Area Sales & Support Manager

Sep 19, 2016 -

The Balver Zinn Group Goes with LLE Soluciones to Guadalajara for the SMTA Mexico Expo & Tech Forum

Sep 16, 2016 -

The Balver Zinn Group Goes with LLE Soluciones to Guadalajara for the SMTA Mexico Expo & Tech Forum

Aug 08, 2016 -

Balver Zinn Group Releases GPC-R-114 a General Purpose Cleaner

Jul 02, 2016 -

Balver Zinn Group Releases GPC-R-114 a General Purpose Cleaner

Jul 01, 2016 -

Balver Zinn Group Releases GPC-R-114 a General Purpose Cleaner

May 21, 2016 -

Balver Zinn and Spectro Analytical Instruments join Forces on Tin Solder Bath Analysis Application

57 more news from Balver Zinn »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

See electronics manufacturing industry news »

Balver Zinn Singapore to Sponsor IPC Hand Soldering Competition in Conjunction with NEPCON Korea 2013 news release has been viewed 789 times

  • SMTnet
  • »
  • Industry News
  • »
  • Balver Zinn Singapore to Sponsor IPC Hand Soldering Competition in Conjunction with NEPCON Korea 2013
Metcal soldering rework

reflow oven profiler