SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Donated Finetech Die Bonder Installed at Pennsylvania State University

Donated Finetech Die Bonder Installed at Pennsylvania State University

Mar 11, 2013

A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University. As part of the company’s 20th anniversary last year, Finetech held a donation drawing for a $100,000 high-accuracy bonding system that was open to universities and colleges. This was Finetech’s way of giving back to the university R&D segment of its business. Penn State was the randomly selected winner out of nearly 400 entries.

We have been using the Pico bonder for a couple of months now and are pleased to have added high-accuracy bonding capabilities to our facility,” states Srinivas Tadigadapa, Pennsylvania State University, Professor, College of Engineering ― MEMS Nanoscale and Devices Group. “We are able to use it for our MEMS device packaging, microfluidic devices and laser diode devices research. The students particularly like the user interface of the machine and appreciate the high accuracy placement of aligned dies.”

With a wide installed base of systems at many prestigious institutions, FINEPLACER® die bonders provide an ideal solution for advanced technology environments utilizing diverse applications. The FINEPLACER® Pico bonder is an ‘all-in-one’ platform for precise packaging and assembly applications, such as flip chip, optoelectronics, 3-D, wafer-level integration, micro-optics assembly, sensor packaging and precise die bonding.

For more information about Finetech, visit http://www.finetechusa.com.

For more information about the MEMS Nanoscale and Devices Group, visit http://mnd.ee.psu.edu/index.asp.


Finetech is a leading manufacturer of equipment for manual and fully automatic component rework and high-precision bonding and die attach.  The company services customers in a broad range of industries including aerospace, medical technology, consumer electronics, semiconductor, optoelectronics, military, universities and research.  Finetech offers a flexible approach to customer support and welcomes the opportunity to create customized, effective solutions.  Corporate headquarters and main production are in Berlin, Germany.  Sales and Technical support centers are located in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China and Kuala Lumpur, Malaysia.


 Pennsylvania State University – MEMS Nanoscale and Devices Group
The Pennsylvania State Electrical Engineering Department, established in 1893, is among the largest, oldest, and most innovative in the nation.  The main focus of the department’s Micro & Nanoscale Devices Group is to design, model, and fabricate devices using MEMS fabrication technologies for transducer applications and investigation of interfacial science at the nanoscale. Research areas include: materials and devices for electronic, photonic, bioelectronic and MEMS applications, amorphous and crystalline silicon, III-V compounds, organic thin films, ferroelectric and piezo-electric; development of novel device structures and manufacturing methods, device and circuit simulation and modeling, device and material characterization


 

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

Sep 05, 2012 -

High-Accuracy R&D Die Bonder on Display at Finetech Booth #505 at IMAPS 2012 – San Diego

76 more news from Finetech »

Feb 20, 2018 -

Expanding Sales Growth sees New Directors Appointed at Europlacer Americas

Feb 20, 2018 -

ZESTRON to Demonstrate VIGON® RC 303 at IPC APEX 2018

Feb 19, 2018 -

Horizon Sales Heads to San Diego for APEX!

Feb 19, 2018 -

Cogiscan Is Growing: New Regional Sales Manager for the Americas

Feb 19, 2018 -

CyberOptics Demonstrates Advanced Airborne Particle Sensing Technology Recognized as Best Known Method (BKM) at SEMICON China

Feb 19, 2018 -

Award-Winning Reflow, Selective Solder & Rework from Ersa at SMTA Intermountain Expo

Feb 19, 2018 -

SMTA Capital Chapter to Host Chapter Tutorial Program

Feb 19, 2018 -

IPC Releases New IPC/PERM-2901, Pb-free Design and Assembly Implementation Guide IPC-PERM-2901 addresses the impact of Pb-free on reliability and service life for aerospace, defense and high-performa

Feb 19, 2018 -

Nordson YESTECH Installs BX Benchtop AOI System at Fluid Components International

Feb 19, 2018 -

BTU to Demo TrueFlat Technology for Substrate Flatness at SEMICON China

See electronics manufacturing industry news »

Donated Finetech Die Bonder Installed at Pennsylvania State University news release has been viewed 2222 times

  • SMTnet
  • »
  • Industry News
  • »
  • Donated Finetech Die Bonder Installed at Pennsylvania State University
Manufacturing Software

Custom Conformal Coating Masks