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  • Inaugural IPC ESTC Conference & Exhibition Takes Holistic Approach to Product Development and Success Registration is now open

Inaugural IPC ESTC Conference & Exhibition Takes Holistic Approach to Product Development and Success Registration is now open

Mar 07, 2013

The need to look at the big picture or the whole electronic system rather than focusing on its individual parts is the impetus of the IPC Electronic System Technologies Conference and Exhibition (ESTC). This inaugural event targets the entire electronics industry — from product design and analyses through component packaging and printed board assembly to complete systems — to create a new framework for technology interchange and innovation. Registration is now open for this event which features a technical conference, May 20–23, and exhibition on May 21–22 at the New Tropicana Hotel in Las Vegas.

Product realization requires a system approach within the product development process. Today, more than ever, new product development requires the entire supply chain to work in unison,” says Dave Torp, IPC vice president of standards and technology.  “Product development life cycles are becoming extremely compressed. Technology is advancing rapidly. From product conception to final assembly requires a high level of coordination. Putting the entire electronics supply chain into one technology-focused conference allows for streamlined operations.”

Tapping into the expertise of a diverse list of more than 70 industry elite who constitute the IPC ESTC program committee, this new event is designed to touch on all phases of a product lifecycle and will engage experts and industry in meaningful dialogue to identify and address system challenges together.
Covering the broad spectrum of product development, the technical conference will present papers in 13 tracks. These include: product design and development; assembly and SMT; PCB fabrication, materials and design; quality and reliability; fabrication and silicon; test; equipment, tools and modules; packaging and substrates; mechanics; thermals; electrical; materials; and industry analysis and issues.

In addition to the technical conference, eight keynote presentations featuring leading industry experts from Amkor Technology, Cadence Design Systems, Intel Corporation, Lenovo, Medtronic, Microsoft, Multitest Elektronische Systeme GmbH and STATS ChipPAC will provide valuable insights into all arenas of system technologies.

IPC ESTC will also offer professional development courses and sponsored workshops on design for reliability and DDR3 interface design; an exhibition; networking receptions; luncheons; and standards development meetings.

More information on IPC ESTC is available at www.ipc.org/ESTC. For registration options, visit www.ipc.org/ESTC-register. Access to the exhibit hall is free to pre-registrants, a savings of $25 on-site. Individuals who register by April 26 can save $100 on a technical conference registration. 


IPC (www.IPC.org) is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.17 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Suzhou, Chengdu and Beijing, China.

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