SMTA S.E. Asia Technical Conference Program Finalized

Mar 05, 2013

SMTA is very excited to announce the three-day South East Asia Technical Conference on Electronics Assembly Technologies, to be held April 17-19, 2013 at the Eastin Hotel in Penang, Malaysia. 

Conference Chair Mei Ming Khaw, Agilent, has assembled a highly technical program that will be very informative for attendees of various backgrounds. Conference sessions will cover Supply Chain issues, Solder Printing, Alternate Alloys, BTC Assembly & Repair, Counterfeit Components, Cleaning, New Material Reliability, and Advanced Packaging.

Companies participating in the program include Cisco Systems Ltd., Flextronics, Henkel, IBM Corporation, Indium Corporation, Jabil Circuit, Kester, and Plexus Corp.

Training workshops will be held on Wednesday, April 17. Workshop topics will be Pb-Free Soldering, Package on Package Technology, Material Properties of Electronic Devices, and Embedded SMT Assembly.

Event website:
http://smta.org/education/symposia/symposia.cfm#penang

Special thanks goes to the technical committee for putting together this outstanding program.  The committee consists of Conference Chair Mei Ming Khaw, Agilent; KL Lim, Plexus; Lian-Huat Ng, Plexus; Teng Hoon Ng, Celestica, Inc.; Jonas Sjoberg, Flextronics; AK Tan, Robert Bosch Sdn Bhd; and David Vetharudge, Listech Technology.

The SE Asia Technical Conference on Electronics Assembly Technology is sponsored by the SMTA with support from the Persatuan Surface Mount Technology P. Pinang.

Contact Patti Hvidhyld, patti@smta.org, with questions or comments.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

 

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